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RO4003C Double Sided Rogers PCB Built on 20mil (0.508mm) Substrates with Via Filled and Immersion Gold Process

Shipped: 26th-June-2023

The newly shipped RF PCB is a high-quality double-sided 2-layer board offered to meet your specific needs. The board is made of Rogers RO4003C material with a lead-free process and can operate within a temperature range of -40℃ to +85℃.

The stackup consists of a base copper of 35um, plating, RO4003C core measuring 20mil (0.508mm), and another base copper of 35um, plating. The board dimensions are 116mm x 147mm=8 Types=8 PCS, with a finished board thickness of 0.68mm, and a finished Cu weight of 1.3 oz (2 mils) all layers. The via plating thickness is 1mil, and the surface finish is Electroless Nickle and Immersion Gold (ENIG). The top and bottom silkscreens are not included, while the top solder mask is green and the bottom solder mask is green.

The PCB includes 100% electrical testing, with slotted holes defined as per Gerber plated through, and all edges tab-routed. The minimum trace/space is 5/5 mils, and the minimum hole size is 0.4mm. There are no blind/buried vias. The PCB contains 80 components, 143 total pads, 61 thru-hole pads, 82 top SMT pads, and 101 vias.

The board's impedance matching is not included, and the 0.4mm via filled by resin and capped by copper by IPC-4761 Type VII. All non-plated holes for breakouts are included in Gerbers, and breakouts are shown as per design FabDrawing.

For any technical inquiries, please contact us at sales@bicheng-enterprise.com.

Specification	Value
PCB Material	Rogers RO4003C
Lead-Free Process	Yes
Operating Temperature Range	-40℃ to +85℃
Stackup	Double sided 2-layer PCB
	base copper 35um + plating
	RO4003C Core 20mil (0.508mm)
	base copper 35um+ plating
Base Copper	35um
RO4003C Core Thickness	20mil (0.508mm)
Prepreg	No
Finished Board Dimensions	116mm x 147mm=8 Types=8 PCS, +/- 0.15mm
Minimum Trace/Space	5/5 mils
Minimum Hole Size	0.4mm
Blind/Buried Vias	No
Finished Board Thickness	0.68mm
Finished Cu Weight	1.3 oz (2 mils) all layers
Via Plating Thickness	1mil
Surface Finish	Electroless Nickle and Immersion Gold (ENIG)
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	Green
Electrical Test	100%
Slotted Holes	Defined as per Gerber and plated through
Edges	Tab-routed
Non-Plated Holes for Breakouts	Included in Gerbers
Impedance Matching	No
Via Filling	0.4mm via filled by resin and capped by copper by IPC-4761 Type VII
Components	80
Total Pads	143
Thru-Hole Pads	61
Top SMT Pads	82
Bottom SMT Pads	0
Vias	101
Nets	46

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