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RO4350B Multilayer PCB Hybrid Circuit Board Built on 10mil (0.254mm) Substrates and Tg170℃ FR-4 With ENIG Process and Via Filled

Shipped: 21st-June-2023

We’re glad to introduce our newly shipped hybrid PCB shipped in June 2023, offered to meet your high-performance requirements.

Crafted with Rogers RO4350B and Shengyi Tg170℃ FR-4 materials, this PCB is manufactured with a lead-free process and can operate within a temperature range of -40℃ to +85℃.

It is a multi-layer 8-layer PCB boasting of a base copper of 35um on the top layer, with the RO4350B core measuring 10mil (0.254mm) and another base copper of 35um on Internal layer 1, the Ground layer. The PCB includes Prepreg, base copper of 35um on Internal layer 2, the signal layer, Shengyi Tg170℃ FR-4 measuring 0.15mm, base copper of 35um on Internal layer 3, the signal layer, Prepreg, base copper of 35um on Internal layer 4, the signal layer, Shengyi Tg170℃ FR-4 measuring 0.15mm, base copper of 35um on Internal layer 5, the signal layer, Prepreg, base copper of 35um on Internal layer 6, the Power layer, RO4350B Core measuring 10mil (0.254mm), and a base copper of 35um on the bottom layer.

The PCB measures 102mm x 98mm=1 PCS, +/- 0.15mm, with a minimum Trace/Space of 4/4 mils and a minimum hole size of 0.2mm. The finished board thickness is 1.6 mm, with a finished Cu weight of 1.0 oz (1.4 mils) all layers. The via plating thickness is 1 mil, with an Electroless Nickle and Immersion Gold (ENIG) surface finish. The top silkscreen is black, and the bottom silkscreen is black, while the top solder mask is Matt white, and the bottom solder mask is Matt white. The PCB undergoes a 100% electrical test, with slotted holes defined as per Gerber plated through and the side-by-side holes defining the dimensions of the slots. All edges are tab-routed, with non-plated holes for breakouts included in Gerbers, and breakouts shown as per design FabDrawing.

Impedance matching on the top layer is 20mil/11mil 50 ohm +/-10%, and the PCB includes 0.2mm and 0.5mm via filled by resin and capped by copper by IPC-4761 Type VII.

This PCB contains 481 components, 495 total pads, 172 thru-hole pads, 193 top SMT pads, 130 bottom SMT pads, 201 vias, and 57 nets. For any technical questions or inquiries, please contact us at sales@bicheng-enterprise.com.

Specifications	Value
PCB Material	Rogers RO4350B + Shengyi Tg170℃ FR-4
Lead-Free Process	Yes
Operating Temperature Range	-40℃ to +85℃
Stackup	Multilayer 8-layer PCB
	base copper 35um, Top Layer
	- RO4350B Core 10mil (0.254mm)
	- base copper 35um, Internal layer 1, Ground layer
	Prepreg
	- base copper 35um, internal layer 2, signal layer
	- Shengyi Tg170℃ FR-4, 0.15mm
	- base copper 35um, Internal layer 3, signal layer
	Prepreg
	- base copper 35um, internal layer 4, signal layer
	- Shengyi Tg170℃ FR-4, 0.15mm
	- base copper 35um, Internal layer 5, signal layer
	Prepreg
	- base copper 35um, Internal layer 6, Power layer
	- RO4350B Core 10mil (0.254mm)
	- base copper 35um, Bottom layer
Base Copper	35um
RO4350B Core Thickness	10mil (0.254mm)
Shengyi Tg170℃?FR-4 Thickness	0.15mm
Prepreg	Yes
Finished Board Dimensions	102mm x 98mm=1 PCS, +/- 0.15mm
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.2mm
Blind/Buried Vias	No
Finished Board Thickness	1.6mm
Finished Cu Weight	1.0 oz (1.4 mils) all layers
Via Plating Thickness	1 mil
Surface Finish	Electroless Nickel and Immersion Gold (ENIG)
Top Silkscreen	Black
Bottom Silkscreen	Black
Top Solder Mask	Matt White
Bottom Solder Mask	Matt White
Electrical Test	100%
Slotted Holes	Defined as per Gerber and plated through
Edges	Tab-routed
Non-Plated Holes for Breakouts	Included in Gerbers
Impedance Matching	Top layer 20mil/11mil 50 ohm +/-10%
Via Filling	0.2mm and 0.5mm via filled by resin and capped by copper by IPC-4761 Type VII
Components	481
Total Pads	495
Thru-Hole Pads	172
Top SMT Pads	193
Bottom SMT Pads	130
Vias	201
Nets	57

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