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Polyimide High Frequency Multilayer 4-layer High Temperature PCB Board Built on Tg250 ℃ Material With Matt Green and Immersion Gold

Shipped: 20th-June-2023

This PCB is a 4-layer multilayer board designed and produced by Shenzhen Bicheng Electronics Technology Co., Ltd. The board has a finished thickness of 1.8mm and is made of Polyimide Tg250 ℃ High Temperature High Frequency Material, which can withstand high temperatures and operate safely in a range from -40℃ to +85℃. The lead-free process used during production makes it environmentally friendly.

The stackup of the board consists of Polyimide Core 0.508mm and base copper weight of 35um, with a Prepreg layer in between each layer. The finished copper weight is 1.0 oz (1.4 mils) on all layers. The minimum trace/space and hole size are 4/4 mils and 0.3mm, respectively. The board has no blind/buried vias, but the 0.3mm vias are filled by resin and capped by copper according to IPC-4761 Type VII. The surface finish is Electroless Nickel and Immersion Gold (ENIG), with a top and bottom silkscreen in white, and top and bottom solder masks in matte green.

The board has slotted holes defined as per Gerber, which are plated through, and all edges are tab-routed. The board includes 372 components, 435 total pads, 151 thru-hole pads, 132 top SMT pads, 152 bottom SMT pads, 192 vias, and 58 nets. The PCB has undergone a 100% electrical test to ensure it meets the required specifications.

For any technical questions, we can be contacted at sales@bicheng-enterprise.com.

Specification	Value
PCB Material	Polyimide Tg250 ℃
Lead-Free Process	Yes
Operating Temperature	-40℃ to +85℃
Stackup	4-layer Multilayer
	- base copper 35um
	- Polyimide Core 0.508mm
	- base copper 35um
	Prepreg
	- Polyimide Core 0.508mm
	Prepreg
	- base copper 35um
	- Polyimide Core 0.508mm
	- base copper 35um
Base Copper Weight	35um
Finished Copper Weight	1.0 oz (1.4 mils) all layers
PCB Thickness	1.8mm
PCB Dimensions	186mm x 76mm, +/- 0.15mm
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.3mm
Blind/Buried Vias	None
Via Filling	Resin and Copper (IPC-4761 Type VII)
Surface Finish	Electroless Nickle and Immersion Gold (ENIG)
Top Silkscreen Color	White
Bottom Silkscreen Color	White
Top Solder Mask Color	Matte Green
Bottom Solder Mask Color	Matte Green
Electrical Test	100%
Slotted Holes	Plated Through
Edges	Tab-Routed
Components	372
Total Pads	435
Thru Hole Pads	151
Top SMT Pads	132
Bottom SMT Pads	152
Vias	192
Nets	58

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