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Polyimide 4-Layer High Temperature High Frequency PCB Built on Tg250 ℃ Substrates with Immersion Gold and Via Filled

Shipped: 19th-June-2023

We are excited to introduce our latest high-quality printed circuit board (PCB) shipment in June 2023. The newly shipped PCB is designed with the most advanced Polyimide Tg250 ℃ high-temperature high-frequency material, ensuring durability and reliability for all your applications. The lead-free process and operating temperature range of -40℃ to +85℃ make it ideal for a multitude of uses.

It is a multilayer 4-layer PCB featuring base copper 35um, Polyimide Core 0.508mm, Prepreg, and base copper 35um, with a finished board thickness of 1.2 mm and finished Cu weight of 1.0 oz (1.4 mils) for all layers. Electroless nickel and immersion gold (ENIG) is used for the surface finish, with a top silkscreen in white and a bottom silkscreen in white. The top solder mask is matt black, while the bottom solder mask is also matt black.

We guarantee the PCB's quality and reliability by subjecting it to 100% electrical testing. The board dimensions measure 346mm x 106mm=1 PCS, with a tolerance of +/- 0.15mm. The minimum trace/space of 4/4 mils and the minimum hole size of 0.25mm ensure high precision. The PCB contains no blind or buried vias, and all vias are plated through with a via plating thickness of 1 mil. The use of slotted holes defined as per Gerber ensures that the side-by-side holes define the dimensions of the slots. Additionally, all edges are tab-routed, and non-plated holes for breakouts are included in Gerbers, with breakouts shown as per design FabDrawing.

Furthermore, this PCB contains 672 components, 685 total pads, 262 thru-hole pads, 183 top SMT pads, 240 bottom SMT pads, 202 vias, and 67 nets. Impedance matching is not required for this PCB.

To inquire about our PCB or if you have any technical questions, please contact us at sales@bicheng-enterprise.com. We are committed to providing high-quality RF PCBs to our valued customers.

Specification	Value
PCB Material	Polyimide Tg250 ℃ High Temperature High Frequency Material
Lead-Free Process	Yes
Operating Temperature Range	-40℃ to +85℃
Stackup	Multilayer 4-layer PCB
	base copper 35um
	Polyimide Core 0.508mm
	base copper 35um
	Prepreg
	base copper 35um
	Polyimide Core 0.508mm
	base copper 35um
Finished Board Thickness	1.2mm
Finished Cu Weight	1.0 oz (1.4 mils) all layers
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.25mm
Blind/Buried Vias	No
Via Plating Thickness	1 mil
Surface Finish	Electroless Nickel and Immersion Gold (ENIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	Matt Black
Bottom Solder Mask	Matt Black
Electrical Test	100%
Slotted Holes	Defined as per Gerber and plated through
Edges	Tab-routed
Non-Plated Holes for Breakouts	Included in Gerbers
Impedance Matching	Not Required
Via Filling	0.25mm via filled by resin and capped by copper
Components	672
Total Pads	685
Thru-Hole Pads	262
Top SMT Pads	183
Bottom SMT Pads	240
Vias	202
Nets	67

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