Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
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info@bicheng-enterprise.com
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RO3006 Double Sided Rogers High Frequency PCB Built on 25mil (0.635mm) Substrates With Immersion Gold

Shipped: 19th-June-2023  

We are pleased to announce the shipment of our latest RF PCB, designed and manufactured with the highest quality materials and advanced techniques to meet your specific requirements.

This RF PCB is made with Rogers RO3006 material and a lead-free process, ensuring superior performance and reliability. It operates flawlessly within a wide temperature range of -40℃ to +85℃, making it suitable for various applications.

Constructed with a double-sided stackup, the PCB features base copper 17um + plating, RO3006 Dielectric 25mil (0.635mm), and base copper 17um + plating. The board dimensions measure 26mm x 50mm=1 PCS with a tolerance of +/- 0.15mm.
The PCB has a finished board thickness of 0.8mm and a finished copper weight of 1.0 oz (1.4 mils) all layers. It features a minimum trace/space of 8/8 mils and a minimum hole size of 0.25mm. The PCB contains no blind or buried vias, and all vias are plated through with a via plating thickness of 1mil. The surface finish is Electroless Nickle and Immersion Gold (ENIG) with a green top solder mask and no bottom solder mask. The top silkscreen is white.
The PCB has 6 components, 7 total pads, 3 thru-hole pads, 4 top SMT pads, 0 bottom SMT pads, 18 vias, and 3 nets. It is manufactured with 100% electrical testing to ensure quality and reliability.
At Bicheng Electronics Technology Co, Ltd., we are committed to providing high-quality electronic components and PCBs. If you have any technical questions, please don't hesitate to contact us at sales@bicheng-enterprise.com.
 
 

PCB Specifications

Value

PCB Material

Rogers RO3006

Lead-free process

Yes

Operating Temperature Range

-40℃ to +85℃

 

Stackup

 

 

Double Sided PCB

base copper 17um + plating

RO3006 Dielectric 25mil (0.635mm)

base copper 17um + plating

Board Dimensions

26mm x 50mm = 1 PCS

Board Tolerance

+/- 0.15mm

Minimum Trace/Space

8/8 mils

Minimum Hole Size

0.25mm

Blind/Buried Vias

No

Finished Board Thickness

0.8mm

Finished Copper Weight

1.0 oz (1.4 mils) all layers

Via Plating Thickness

1 mil

Surface Finish

Electroless Nickle and Immersion Gold (ENIG)

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

Green

Bottom Solder Mask

No

100% Electrical Test

Yes

Impedance Matching

No

Components

6

Total Pads

7

Thru Hole Pads

3

Top SMT Pads

4

Bottom SMT Pads

0

Vias

18

Nets

3

 
 
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