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RO4003C Rogers PCB Built on 32mil (0.813mm) Substrates with Double Sided, Dual Layer and Immersion Gold Process

Shipped: 14th-June-2023

We are excited to introduce our latest high frequency PCB shipped in June 2023. This PCB is made with Rogers RO4003C material and features a lead-free process, making it an ideal choice for your electronic needs.

The stackup is composed of 2 layers of one base copper of 35um, RO4003C dielectric of 32mil, and another base copper of 35um, ensuring that the PCB meets your specific requirements. It has a finished board thickness of 0.98mm and a finished copper weight of 1 oz (1.4 mils) for all layers.

This PCB has a board dimension of 42mm x 65mm, with a minimum trace/space of 12/14 mils and a minimum hole size of 16 mils. It also features no blind or buried vias and via plating thickness of 1 mil. The surface finish is Electroless Nickle and Immersion Gold (ENIG), and the PCB features no top or bottom silkscreen. The top solder mask is green, and the bottom solder mask is also green. We have also performed a 100% electrical test to ensure that the board meets industry standards.

One of the unique features of this PCB is the 0.5mm via, which is filled by resin and capped for additional durability and protection of your electronic components.

The PCB comes with 18 components and 27 total pads, with 19 thru hole pads and 8 top SMT pads, and no bottom SMT pads. It also has 59 vias and 8 nets.

At Bicheng Limited, we take pride in providing our customers with excellent customer service. If you have any technical questions or would like to learn more about our PCB, please do not hesitate to contact us at sales@bicheng-enterprise.com.

Specification	Value
PCB Material	Rogers RO4003C
Process	Lead-free
Operation	-40℃ to +85℃
Stackup	Double sided PCB
Base copper	35um
Dielectric	32mil (0.813mm) RO4003C
Base copper	35um
Board dimensions	42mm x 65mm=1 PCS, +/- 0.15mm
Minimum Trace/Space	12/14 mils
Minimum Hole Size	16 mils
Blind/buried vias	No
Finished board thickness	0.98 mm
Finished Cu weight	1 oz (1.4 mils) all layers
Via plating thickness	1 mil
Surface finish	Electroless Nickle and Immersion Gold (ENIG)
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	Green
Electrical test used	100%
Components	18
Total Pads	27
Thru Hole Pads	19
Top SMT Pads	8
Bottom SMT Pads	0
Vias	59
Nets	8

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