Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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RO3010 Double Sided, Dual Layer Rogers High Frequency PCB Built on 25mil (0.635mm) Substrates with Copper Exposed

Shipped: 6th-June-2023  

We are pleased to introduce Bicheng's latest RF PCB shipped in June 2023, specially designed for modern electronic devices.

The board features Rogers RO3010 material and is produced using a lead-free process, making it an eco-friendly option. It can operate between -40℃ to +85℃, making it suitable for use in harsh environments.

It is a double-sided stack-up including base copper 17um, dielectric RO3010 25mil, and base copper 17um.
The board measures 8.00 x 8.00 mm, with a minimum trace/space of 5/5 mils and a minimum hole size of 10 mils, ensuring precise and accurate signal transmission. The finished board thickness is 0.8 mm, with a finished Cu weight of 1 oz (1.4 mils) and via plating thickness of 1 mil. The surface finish is copper exposed, with no top or bottom silkscreen or solder mask. Our team has subjected the board to 100% electrical testing, ensuring the highest standards of quality and performance.
With a total of three pads, one via, and one net, this RF PCB is perfect for simple circuit designs. For any technical questions or inquiries, please contact us at sales@bicheng-enterprise.com. Get your hands on Bicheng Limited's newly shipped RF PCB today and experience the optimal performance it offers!
 
 

Specifications

Values

 

PCB Material

 

Rogers RO3010

Lead-free process

-40℃ to +85℃ operation

 

Stackup

 

 

Double sided PCB

Base copper 17um +

Dielectric RO3010 25mil

Base copper 17um

 

 

 

 

 

Construction details

 

 

 

 

 

 

 

Board dimensions: 8.00 x 8.00 mm=1 pcs, +/- 0.15mm

Minimum Trace/Space: 5/5 mils

Minimum Hole Size: 10 mils

Finished board thickness: 0.8 mm

Finished Cu weight: 1 oz (1.4 mils)

Via plating thickness: 1 mil

Surface finish: No surface finish, just copper exposed

Top Silkscreen: No

Bottom Silkscreen: No

Top/Bottom Solder Mask: No

Bottom Solder Mask: No

No silkscreen on solder pads

100% Electrical test used

Impedance controlled

No

 

 

 

PCB Statistics

 

 

 

Components: 1

Total Pads: 3

Thru Hole Pads: 1

Top SMT Pads: 1

Bottom SMT Pads: 1

Vias: 2

Nets: 1

 
 
 
 
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