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RO4350B 6-Layer Hybrid PCB Built on Rogers Material and Shengyi Tg170℃ FR-4 with via Filled and Immersion Gold

Shipped: 5th-June-2023

We are excited to introduce our newly shipped RF PCB launched in June 2023, with the latest technologies and materials to meet the needs of high-frequency applications.

The PCB is made of Rogers RO4350B and high Tg170℃ FR-4 materials, ensuring optimal performance and durability. The lead-free production process makes it an eco-friendly option, while its ability to operate between -40℃ to +85℃ makes it suitable for challenging environments.

The stackup design features a 6-layer hybrid structure, providing flexibility for intricate circuit designs. It measures 1.13mm in finished thickness, ensuring optimal mechanical strength. The minimum trace/space is 6/6 mils, while the minimum hole size is 10 mils, ensuring precise and accurate signal transmission.

The vias of 0.25mm are filled by resin and capped, ensuring excellent electrical conductivity. The finished Cu weight is 1 oz (1.4 mils) outer layers and 0.5 oz inner layers, while the via plating thickness is 1 mil, ensuring excellent electrical connectivity. The surface finish is immersion nickel and immersion gold (ENIG), providing superior corrosion resistance and ensuring a long lifespan.

The top silkscreen is white, while the bottom solder mask is matte black, providing a clean and professional look. The board undergoes 100% electrical testing to guarantee the highest standards of quality and performance.

The impedance-controlled top layer features an 18.5mil track and a 50 ohm +/-10% tolerance, ensuring precise signal transmission and impedance control. The board has 53 components, 67 total pads, and 49 vias, making it ideal for complex circuit designs. It has 33 thru-hole pads, 22 top SMT pads, and 12 bottom SMT pads, providing flexibility for various component types. The board has 15 nets, ensuring efficient signal routing.

For any technical questions or inquiries, interested parties may contact Bicheng Limited at sales@bicheng-enterprise.com.

Specifications	Values
PCB Material	Rogers RO4350B + High Tg170℃ FR-4
	Lead-free process
	-40℃ to +85℃ operation
Stackup	6-Layer hybrid PCB
	Base copper 17um
	Dielectric RO4350B 10mil
	Base copper 17um
	Prepreg
	Base copper 17um
	Dielectric FR-4 12mil
	Base copper 17um
	Prepreg
	Base copper 17um
	Dielectric RO4350B 10mil
	Base copper 17um
Construction details	Board dimensions: 56.00 x 49.00 mm=1 pcs
	Minimum Trace/Space: 6/6 mils
	Minimum Hole Size: 10 mils
	Via: 0.25mm filled by resin and capped
	Finished board thickness: 1.13 mm
	Finished Cu weight: 1 oz (1.4 mils) outer
	layers, 0.5oz inner layers
	Via plating thickness: 1 mil
	Surface finish: Immersion Nickle and
	Immersion Gold (ENIG)
	Top Silkscreen: White
	Bottom Silkscreen: No
	Top/Bottom Solder Mask: Matt Black
	No silkscreen on solder pads
	100% Electrical test used
Impedance controlled	Top layer 18.5mil track, 50 ohm +/-10%
PCB Statistics	Components: 53
	Total Pads: 67
	Thru Hole Pads: 33
	Top SMT Pads: 22
	Bottom SMT Pads: 12
	Vias: 49
	Nets: 15

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