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RO3003 6-Layer Rogers High Frequency PCB Built on 5mil (0.127mm) Low Loss Material With ENEPIG Surface Finish

Shipped: 2nd-June-2023

We are proud to introduce our latest RF PCB product offering in June 2023.

This 6-layer high-frequency PCB is designed to deliver exceptional performance and reliability in modern electronics. The board is composed of Rogers RO3003 material, which has a dielectric constant of 3.00 and loss tangent of 0.0013 at 10 GHz. The use of Rogers RO3003 material ensures that the PCB delivers high-frequency performance, low insertion loss, and excellent heat dissipation.

The PCB stackup is designed to optimize signal integrity and eliminate any interference or noise. It comprises of six layers, with base copper layers of 17um and dielectric layers of 5mil RO3003. The layers are separated by prepreg bondply 2929, which gives the board its mechanical strength and stability. The use of a 6-layer stackup allows for more complex circuit designs and reduces the overall size of the PCB.

The board measures 20.00 x 15.00 mm and has a finished board thickness of 0.7mm. The finished Cu weight is 1 oz (1.4 mils) outer layers and 0.5oz inner layers, which ensures good conductivity and heat dissipation. The PCB is plated with a 1 mil via plating thickness, which provides a reliable connection between layers. The surface finish of the PCB is immersion nickle immersion palladium and immersion gold (ENEPIG), which provides excellent corrosion resistance and solderability.

The PCB design supports a range of applications and features a total of 11 components, 39 total pads, 21 thru-hole pads, 15 top SMT pads, 3 bottom SMT pads, 51 vias, and 9 nets. The minimum trace/space is 6/5 mils, and the minimum hole size is 12 mils.

It's important to note that this PCB comes without any top or bottom silkscreen or solder mask. This is done to reduce the overall thickness of the board and improve its electrical performance. The board is 100% electrically tested to ensure that it meets the required specifications and standards.

For any technical inquiries or questions, please contact Bicheng Limited at sales@bicheng-enterprise.com. We pride ourselves on offering high-quality and reliable PCB solutions for your specific needs.

Specifications	Value
PCB Material	Rogers RO3003
Operation Temperature	-40℃ to +85℃
Stackup	6-Layer High Frequency PCB
	base copper 17um
	dielectric RO3003 5mil
	base copper 17um
	Prepreg Bondply 2929
	base copper 17um
	dielectric RO3003 5mil
	base copper 17um
	Prepreg bondply 2929
	base copper 17um
	dielectric RO3003 5mil
	base copper 17um
Board Dimensions	20.00 x 15.00 mm=1 pcs, +/- 0.15mm
Minimum Trace/Space	6/5 mils
Minimum Hole Size	12 mils
Finished Board Thickness	0.7 mm
Finished Cu Weight	1 oz (1.4 mils) outter layers, 0.5oz inner layers
Via Plating Thickness	1 mil
Surface Finish	Immersion Nickle Immersion Palladium and Immersion Gold (ENEPIG)
Top Silkscreen	No
Bottom Silkscreen	No
Top/Bottom Solder Mask	No
Silkscreen on Solder Pads	No
Electrical Test	100%
Components	11
Total Pads	39
Thru Hole Pads	21
Top SMT Pads	15
Bottom SMT Pads	3
Vias	51
Nets	9

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