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High Frequency PCB Built on RO4350B 30mil
 
  1.1 General description
  This is a type of dual layer PCB built on 30mil RO4350B substrate with Tg 280°C for the application of Antenna WiFi. It's 0.8 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. All vias are designed with open-solder-mask. The base material is from Rogers supplying 2 designs 2 up PCBs per panel to save cost. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 50 panels are packed for shipment.
 
  1.2 Features and benifits
  Good high temperature and low temperature resistance.（-192℃-260℃)
Exhibit a stable dielectric constant over a broad frequency range. Ideal substrate for broadband applications.
Stable electrical coefficient of dielectric constant.
Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
High voltage test, Impedance control test, micro-section, solder-ability test,
Right manufacturing instruction (MI),
Delivery on time: >98%
Eligible products rate of first production: >95%
Competitive price
 
  1.3 Application
  Splitter, Variocoupler, Microstrip antenna,3G antenna, Relay Stations, RF Switches
   
  1.4 Parameter and data sheet
 
Base Material: RO4350B 30 mil (0.762 mm)
Copper Weight: 1 oz each layer
Board Thickness: 0.8 mm ±10%
Layer Count: 2 layers
Board Size: 35 x 77 mm=2 designs = 2PCS
Solder Mask: Green solder mask | white silkscreen
Surface Finish: Immersion gold
Via: via tented
Warpage: ＜0.75%
Net Weight: 0.004 kg/panel
Acceptable Standard: IPC-Class-2
Lead time for prototype: 10 working days
Shelflife: 6 months
   
 
 

 

 

 
　

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