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Double sided MCPCB, HASL LF
RO4003C(32 mil) immersion gold PCB
Quick Turn Prototype PCB
ITEQ 10 Layer FR-4 TG170 PCB
CSP-mounted via in pad PCB
micro BGA immersion gold PCB
RO4350B(30mil) Immersion Gold PCB
Impedance controlled PCB
Mixed material 10 Layer PCB

 

 

ITEQ FR-4 TG170 10Layer Immersion gold PCB

PCB dimension: 245 x 221mm=1PCS
Basic stack up: 10 Layer PCB
  copper ------- 35um(1oz)+plate TOP Signal
  4mil prepreg
  copper ------- 18um(0.5oz) GND Plane
  5mil FR-4
  copper ------- 18um(0.5oz) SIG1
  5mil prepreg
  copper ------- 18um(0.5oz) SIG2
  5mil FR-4
  copper ------- 18um(0.5oz) PWR Plane
  13mil prepreg
  copper ------- 18um(0.5oz) GND Plane
  5mil FR-4
  copper ------- 18um(0.5oz) SIG3
  5mil prepreg
  copper ------- 35um(1oz) SIG4
  5mil FR-4
  copper ------- 35um(1oz) GND Plane
  4mil prepreg
  copper ------- 35um(1oz)+plate BOT Signal
Minimum trace and space 4mil/4mil
Minimum / maximum holes 0.3/2.6mm
Number of different holes 32
Number of drill holes 18541
Number of milled slots 2
Material: IT180A, TG170
Surface finish: Immersion gold (30.1% area)
Solder mask: Gloss green
Contour: rout (mill), v-groove, slot
Via: plated through hole(PTH), min. size 0.254mm
Final height of PCB 1.6mm ±0.16
Impedance control: L1,L3,L4,L7,L8,L10 single end 50ohm on 4, 5 and 5.8 track
  L4,L7 differential 90ohm on 4/6, 4/4 track/space

 

 

 

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