Taconic RF-35A2 PCB Supplier

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Taconic RF-35A2 High Frequency PCB

Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.

The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.

RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.

Benefits:
Low loss properties
DK tolerance of +/- 0.05
Homogeneous DK
Excellent peel strength
Low moisture absorption

Applications:
Power amplifiers
Filters / couplers
High speed digital
Passive components
Wireless antennas

Our PCB Capabilities (RF-35A2)

PCB Material:	PTFE Ceramic Fiberglass
Designation:	RF-35A2
Dielectric constant:	3.15
Dissipation Factor	0.0015
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm)
Laminate thickness:	10mil (0.254mm), 20mil (0.508mm), ?30mil (0.762mm), ?60mil (1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

Typical Value of Taconic RF-35A2

Property	Test Method	Unit	Value	Unit
Dk @ 10 GHz	IPC-650 2.5.5.5.1 (Modified)		3.5
Df @ 10 GHz	IPC-650 2.5.5.5.1 (Modified)		0.0015
Moisture Absorption	IPC-650 2.6.2.1	%	0.03	%
Dielectric Breakdown	IPC-650 2.5.6/ASTM D 149	kV	59	kV
Dielectric Strength	ASTM D 149	V/mil	1000	V/mm
Volume Resistivity	IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)	Mohm/cm	10^9	Mohm/cm
Surface Resistivity	IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)	Mohm	10^8	Mohm
Arc Resistance	IPC-650 2.5.1	Seconds	242	Seconds
Flexural Strength (MD)	IPC-650 2.4.4	kpsi	24	N/mm2
Flexural Strength (CD)	IPC-650 2.4.4	kpsi	15	N/mm2
Tensile Strength (MD)	ASTM D 3039	psi	16,800	N/mm2
Tensile Strength (CD)	ASTM D 3039	psi	11,000	N/mm2
Young’s Modulus (MD)	ASTM D 3039	psi	106	N/mm2
Young’s Modulus (CD)	ASTM D 3039	psi	106	N/mm2
Poisson’s Ratio (MD)	ASTM D 3039		0.14
Poisson’s Ratio (CD)	ASTM D 3039		0.1
Strain at Break (MD)	ASTM D 3039	%	1.6	%
Strain at Break (CD)	ASTM D 3039	%	1.4	%
Compressive Modulus (Z axis)	ASTM D 695 (23°C)	kpsi	385	N/mm2
Peel Strength (1 oz. VLP)	IPC-650 2.4.8 (Thermal Stress)	lbs/in	12	N/mm
Peel Strength (1 oz. VLP)	IPC-650 2.4.8.3 (150°C ) (Elevated Temp.)	lbs/in	14	N/mm
Peel Strength (1 oz. VLP)	IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals)	lbs/in	11	N/mm
Density (Specific Gravity)		gm/cm3	2.28	gm/cm3
Specific Heat	ASTM E 1269 (DSC) (100°C)	J/g/K	0.99	J/g/K
Thermal Conductivity	ASTM F 433	W/M*K	0.29	W/M*K
Td	IPC-650 2.4.24.6 2% Weight Loss	°C	528	°C
Td	IPC-650 2.4.24.6 5% Weight Loss	°C	547	°C
CTE (x)	IPC-650 2.4.41 (>RT - 125°C)	ppm/°C	10	ppm/°C
CTE (y)	IPC-650 2.4.41 (>RT - 125°C)	ppm/°C	13	ppm/°C
CTE (z)	IPC-650 2.4.41 (>RT - 125°C)	ppm/°C	108	ppm/°C