TU-768 PCB 2-layer 0.8mm

WELCOME TO BICHENG

Shipped: 22nd-Dec-2023

1. TU-768 Introduction
Taiwan Union's TU-768 is a type of high-Tg and high thermal reliability laminate, the matching prepreg designated TU-768P.
TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

2. Features
- Dk of 4.3 at 10GHz
- Dissipation factor of .0023 at 10GHz
- CTE x-axis of 11-15 ppm/°C, CTE y-axis of 11-15 ppm/°C
- Coefficient of thermal expansion matched to copper
- Decomposition Temperature (Td) of 350 °C TGA
- Tg (DSC) of 180°C
- T260 >60 min, T288>15 min, T300 >2 min

3. Benefits
- Lead Free process compatible
- Excellent coefficient of thermal expansion
- Anti-CAF property
- Superior chemical and thermal resistance
- Fluorescence for AOI
- Moisture resistance

4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
TU-768 Core - 0.76 mm
Copper_layer_2 - 35 μm

5. PCB Construction details:
- Board dimensions: 47.8mm x 47.8 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.2mm
- No Blind vias.
- Finished board thickness: 0.8mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Black
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

6. PCB Statistics:
Components: 11
Total Pads: 24
Thru Hole Pads: 15
Top SMT Pads: 9
Bottom SMT Pads: 0
Vias: 7
Nets: 2

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:
- Consumer Electronics
- Server, workstation
- Automotive

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