Today we’re going to introduce to you a groundbreaking innovation in the field of microwave materials - Rogers TMM 6 thermoset microwave material. This cutting-edge ceramic thermoset polymer composite is specifically engineered to revolutionize high-frequency applications, particularly in plated thru-hole reliability strip-line and micro-strip designs.

What sets TMM 6 laminates apart is their ability to harness the advantages of both ceramic and traditional PTFE microwave circuit laminates, all while eliminating the need for specialized production techniques commonly associated with these materials.

Now let's delve into the detailed properties of TMM 6.

TMM 6 is a high-performance thermoset microwave material developed by Rogers.

One of the standout features of TMM 6 laminates is their unique dielectric constant (Dk). With a value of 6.0±0.08, it provides reliable performance in the Z direction at 10 GHz, as tested using IPC-TM-650 2.5.5.5. Additionally, the design dielectric constant is measured at 6.3, covering a wide frequency range from 8 GHz to 40 GHz using the Differential Phase Length Method.

The dissipation factor (process) of TMM 6 is impressively low at 0.0023 in the Z direction at 10 GHz, ensuring minimal signal loss during transmission.

The material exhibits a thermal coefficient of dielectric constant of -11 ppm/°K within a temperature range of -55℃ to 125℃, as determined by IPC-TM-650 2.5.5.5. This property ensures the stability of the dielectric constant over a wide temperature range.

Regarding thermal properties, TMM 6 has a decomposition temperature (Td) of 425℃, determined by TGA testing according to ASTM D3850. The coefficient of thermal expansion is reported as 18 ppm/K in the X and Y directions, and 26 ppm/K in the Z direction within a temperature range of 0 to 140℃. These values ensure compatibility with copper and help reduce the risk of thermal stress during operation.

TMM 6 exhibits good thermal conductivity with a value of 0.72 W/m/K in the Z direction at 80℃, as measured using ASTM C518. This property allows for efficient heat dissipation in high-power applications.

In terms of mechanical properties, TMM 6 demonstrates a strong copper peel strength after thermal stress at 5.7 lb/inch (1.0 N/mm), following solder float with 1 oz. ED copper, as per IPC-TM-650 Method 2.4.8. The flexural strength in the MD and CMD directions is measured at 15.02 kpsi, and the flexural modulus is 1.75 Mpsi, as determined by ASTM D790.

TMM 6 has a moisture absorption rate of 0.06% for a 1.27mm (0.050") thickness and 0.2% for a 3.18mm (0.125") thickness, measured using ASTM D570. The specific gravity of the material is 2.37, indicating its density compared to water, as specified in ASTM D792. The specific heat capacity is calculated as 0.78 J/g/K.

Finally, TMM 6 is compatible with lead-free processes, allowing for environmentally friendly manufacturing without compromising performance.

Our TMM6 PCB manufacturing capabilities offer a wide range of options to meet diverse requirements.

When it comes to layer count, we can accommodate double-layer, multilayer, and hybrid PCB designs, providing flexibility for different circuit complexities.

Our manufacturing process allows for precise control of copper weight, with options available for 1oz (35µm), and 2oz (70µm) copper thicknesses.

Laminate thickness is another aspect where we offer a wide range of choices to suit specific applications. The available laminate thicknesses include 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), and 500mil (12.7mm).

This extensive range allows for precise customization based on the specific design and application requirements.

In terms of PCB size, we can manufacture boards with dimensions up to 400mm X 500mm, providing ample space for various electronic designs.

For solder mask options, we offer a range of colors including green, black, blue, yellow, red, and more.

Regarding surface finish, we provide multiple options to ensure optimal electrical performance and protection. These options include ENIG, immersion tin, immersion silver, HASL, pure gold plating, bare copper, ENEPIG and OSP etc.

Displayed on the screen is a 3.2mm TMM6 PCB for chip testing purposes.

TMM6's exceptional dielectric properties make it an excellent choice for RF and microwave circuitry applications. Its versatility extends to power amplifiers, filters, couplers, satellite communication systems, GPS antennas, patch antennas, and dielectric polarizers and lenses, contributing to the reliable and efficient operation of these systems.

TMM6 microwave materials are comprised of a hydrocarbon matrix that is extensively filled with ceramic particles. When drilling TMM6 materials, it is necessary to take precautions due to the abrasive characteristics of the ceramic filler. It is advisable to minimize high tool surface speeds and low chip loads as much as possible, as they can result in excessive heat generation and accelerated tool wear.