TMM4 High Frequency PCB

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Introduction

Hi Guys. Welcome back to our channel. Today, We’re going to talk about a type of high frequency PCB built on thermoset microwave material---TMM 4

Rogers TMM 4 PCB is a ceramic, hydrocarbon, thermoset polymer composite designed for stripline and microstrip applications. It has strong mechanical and chemical properties combined many of the benefits of both ceramic and traditional PTFE materials. It is based on thermoset resins which allows for reliable wire-bonding without pad lifting or substrate deformation.

TMM4 Typical Properties PCB

TMM4 boasts an impressive range of properties that make it an ideal choice for demanding applications. Let's take a closer look at some of its key features.

First, we have the Dielectric Constant of TMM4. With a process value of 4.5±0.045 at 10 GHz, it ensures reliable signal transmission. The Dielectric Constant in the design phase is 4.7, covering a broad frequency range from 8 GHz to 40 GHz.

Moving on to Dissipation Factor, TMM4 shines with a process value of 0.002 at 10 GHz, indicating low signal loss and enhanced performance.

TMM4 also exhibits excellent thermal stability, with a Thermal Coefficient of dielectric constant of +15 ppm/°K over a wide temperature range from -55°C to 125°C.

When it comes to electrical properties, TMM4 impresses with an Insulation Resistance exceeding 2000 Gohm, ensuring reliable insulation performance. The Volume Resistivity measures an impressive 6 x 10^8 Mohm.cm, while the Surface Resistivity stands at 1 x 10^9 Mohm.

Let's talk about the thermal properties of TMM4. It exhibits a Decomposition Temperature (Td) of 425°C, ensuring its stability and reliability even at high temperatures.

The Coefficient of Thermal Expansion of TMM4 is also worth noting. Along the X axis, it measures 16 ppm/K, along the Y axis, it measures 16 ppm/K, and along the Z axis, it measures 21 ppm/K. This means that TMM4 can withstand temperature variations from 0°C to 140°C without significant dimensional changes.

Additionally, TMM4 showcases a Thermal Conductivity of 0.7 W/m/K at 80°C, allowing for efficient heat dissipation in electronic systems.

Moving on to its mechanical characteristics, TMM4 showcases remarkable strength. The Copper Peel Strength after Thermal Stress reaches an impressive 5.7 lb/inch (1.0 N/mm) for both X and Y directions, even after solder float with 1 oz. EDC.

TMM4's Flexural Strength stands at 15.91 kpsi in both the MD (Machine Direction) and CMD (Cross-Machine Direction), ensuring structural integrity in demanding conditions. The Flexural Modulus for MD and CMD is 1.76 Mpsi, indicating excellent stiffness.

TMM4 also exhibits desirable physical properties. Its Moisture Absorption is minimal, with only 0.07% for a 2X2 area at 1.27mm (0.050") thickness and 0.18% at 3.18mm (0.125") thickness.

The Specific Gravity of TMM4 is 2.07, providing a lightweight solution without compromising performance. Additionally, its Specific Heat Capacity is 0.83 J/g/K, contributing to efficient thermal management.

Last but not least, TMM4 is Lead-Free Process Compatible, ensuring compliance with industry standards and environmental regulations.

Property		TMM?4	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		4.5±0.045	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		4.7	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.002	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		+15	-	ppm/°K	-55℃-125℃	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		6 x 108	-	Mohm.cm	-	ASTM D257
Surface Resistivity		1 x 109	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		371	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	℃TGA	-	ASTM D3850
Coefficient of Thermal Expansion - X		16	X	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		16	Y	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		21	Z	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.7	Z	W/m/K	80 ℃	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.7 (1.0)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		15.91	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.76	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.07	-	%	D/24/23	ASTM D570
Moisture Absorption (2X2)	3.18mm (0.125")	0.18	-	%	D/24/23	ASTM D570
Specific Gravity		2.07	-	-	A	ASTM D792
Specific Heat Capacity		0.83	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-

PCB Capability (TMM 4)

For TMM 4 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types.

TMM 4 PCBs have wide thickness. There are the standard thickness such as 20 mils, 30 mils, 50 mils and 60mils etc. and non-standard thickness such as 15 mils, 25 mils,75 mils, and 125 mils etc. It’s as thin as 15 mils and as thick as 500 mils for our designers.

Finished copper on PCB can be 1oz, 2oz and 3oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.

Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, pure gold and bare copper etc. for pads plating.

PCB material:	Composite of Ceramic, hydrocarbon and thermoset polymer
Designation:	TMM 4
Dielectric constant:	4.5 ±0.045 (process); 4.7 (design)
Layer count:	1-layer, 2-layer, Multi-layer, Hybrid types
Laminate thickness:	15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm),50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.620mm), 500mil (12.7mm)
Copper weight:	1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Immersion gold, HASL, Immersin silver, Immersion tin, Pure gold, ENEPIG, Bare copper, OSP etc.

A Piece of TMM 4PCB

On the screen is a double layer TMM4 PCBs on 5.08mm substrate without solder mask. TMM 4 PCBs are typically used in power amplifiers and combiners, filters and couplers, satellite communication systems, GPS antennas, dielectric polarizers and lenses etc.

Conclusion

TMM 4’s mechanical properties resist creep and cold flow. It is resistant to process chemicals, reducing damage during fabrication. All common PCB manufacturing processes can be used with TMM 4 materials, so the volume mass production is available for marketing.

OK. This concludes today’s episode. Thank you for reading. See you next time.