TMM10i PCB 2-layer 20mil

WELCOME TO BICHENG

Shipped: 21st-Dec-2023

1. TMM10i Introduction
Rogers TMM 10i isotropic thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability strip-line and micro-strip applications. TMM 10i microwave material has an isotropic dielectric constant (Dk). Like the other TMM series materials, TMM 10i combines many of the desirable features of ceramic and PTFE substrates, with the ease of soft substrate processing techniques.

2. Features
- Dk of 9.80 +/- .245
- Dissipation factor of .0020 at 10GHz
- Thermal coefficient of Dk of -43 ppm/°K
- Coefficient of thermal expansion matched to copper
- Decomposition Temperature (Td) of 425 °C TGA
- Coefficient of Thermal Expansion - x y z : 19ppm/K, 19ppm/K,20ppm/K
- Thermal Conductivity of 0.76W/mk
- Available in a thickness range of .0015 to .500 inches +/- .0015”

3. Benefits
- Mechanical properties resist creep and cold flow
- Resistant to process chemicals, reducing damage during fabrication
- Material does not require a sodium napthanate treatment prior to electroless plating
- Based on a thermoset resin, allowing for reliable wire-bonding
- Reliable wirebonding

4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers TMM10i Core - 0.508 mm (20mil)
Copper_layer_2 - 35 μm

5. PCB Construction details:
- Board dimensions: 60mm x 70 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 8/8 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

6. PCB Statistics:
Components: 8
Total Pads: 18
Thru Hole Pads: 11
Top SMT Pads: 7
Bottom SMT Pads: 0
Vias: 9
Nets: 2

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and coupler
- Satellite communication systems
- Global Positioning Systems Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers

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