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深圳市碧澄电子科技有限公司
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info@bicheng-enterprise.com
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TLY-5 High Frequency PCB Double Sided 60mil 1.524mm Thickness

Shipped: 9th-Nov-2023  

We are delighted to share a type of new variant of TLY-5 PCBs, a lightweight solution that revolutionizes high-frequency RF and microwave applications by delivering unmatched levels of performance and reliability.

Introduction to TLY-5:
TLY-5 laminates are manufactured using lightweight woven fiberglass and offer superior dimensional stability compared to chopped fiber reinforced PTFE composites. The woven matrix in TLY-5 material provides mechanical stability, making it ideal for high volume manufacturing. With its low dissipation factor, TLY-5 enables successful deployment in automotive radar applications operating at 77 GHz and other millimeter wave frequency antennas.

Key Features:
Dielectric constant of 2.2 with a tight tolerance of 0.02 at 10 GHz/23°C.
Low loss tangent of 0.0009 at 10 GHz.
Density (specific gravity) of 2.19 g/cm3.
Moisture absorption of 0.02%.
Coefficient of Thermal Expansion (CTE): X-axis - 26 ppm/°C, Y-axis - 15 ppm/°C, Z-axis - 217 ppm/°C.

Benefits:
Excellent dimensional stability.
Lowest dissipation factor (DF).
Low moisture absorption.
High copper peel strength.
Uniform and consistent dielectric constant (DK).

PCB Stackup: 2-layer rigid PCB:
Copper Layer 1 - 35 μm.
TLY-5 - 1.524 mm (60 mil).
Copper Layer 2 - 35 μm.

PCB Construction Details:
Board dimensions: 127.72 mm x 97.07 mm = 1 piece, with a tolerance of +/- 0.15 mm.
Minimum Trace/Space: 5/6 mils.
Minimum Hole Size: 0.4 mm.
No blind vias.
Finished board thickness: 1.6 mm.
Finished copper weight: 1 oz (1.4 mils) on outer layers.
Via plating thickness: 20 μm.
Surface finish: Immersion gold.
No top silkscreen.
No bottom silkscreen.
No top solder mask.
No bottom solder mask.
100% electrical test conducted prior to shipment.

PCB Construction Details:
Board dimensions: 127.72 mm x 97.07 mm = 1 piece, with a tolerance of +/- 0.15 mm.
Minimum Trace/Space: 5/6 mils.
Minimum Hole Size: 0.4 mm.
No blind vias.
Finished board thickness: 1.6 mm.
Finished copper weight: 1 oz (1.4 mils) on outer layers.
Via plating thickness: 20 μm.
Surface finish: Immersion gold.
No top silkscreen.
No bottom silkscreen.
No top solder mask.
No bottom solder mask.
100% electrical test conducted prior to shipment.

Some Typical Applications:
Automotive Radar.
Satellite/Cellular Communications.
Power Amplifiers.
LNBs, LNAs, LNCs.
Aerospace.
Ka, E and W band Applications.

Appendix: TLY Data Sheet

 

TLY TYPICAL VALUES

Property

Test Method

Unit

Value

Unit

Value

DK at 10 GHz

IPC-650 2.5.5.5

 

2.2

 

2.2

Df at 10 GHz

IPC-650 2.5.5.5

 

0.0009

 

0.0009

Moisture Absorption

IPC-650 2.6.2.1

%

0.02

%

0.02

Dielectric Breakdown

IPC-650 2.5.6

kV

>45

kV

>45

Dielectric Strength

ASTM D 149

V/mil

2,693

V/mil

106,023

Volume Resistivity

IPC-650 2.5.17.1(after elevated temp.)

Mohms/cm

1010

Mohms/cm

1010

Volume Resistivity

IPC-650 2.5.17.1(after humidity)

Mohms/cm

1010

Mohms/cm

109

Surface Resistivity

IPC-650 2.5.17.1(after elevated temp.)

Mohms

108

Mohms

108

Surface Resistivity

IPC-650 2.5.17.1(after humidity)

Mohms

108

Mohms

108

Flex Strength(MD)

IPC-650 2.4.4

psi

14,057

N/mm2

96.91

Flex Strength(CD)

IPC-650 2.4.4

psi

12,955

N/mm2

89.32

Peel Stength(½ oz.ed copper)

IPC-650 2.4.8

Ibs./inch

11

N/mm

1.96

Peel Stength(1 oz.CL1 copper)

IPC-650 2.4.8

Ibs./inch

16

N/mm

2.86

Peel Stength(1 oz..CV1 copper)

IPC-650 2.4.8

Ibs./inch

17

N/mm

3.04

Peel Stength

IPC-650 2.4.8(after elevated temp.)

Ibs./inch

13

N/mm

2.32

Young's Modulus(MD)

ASTM D 3039/IPC-650 2.4.19

psi

1.4 x 106

N/mm2

9.65 x 103

Poisson's Ratio(MD)

ASTM D 3039/IPC-650 2.4.19

 

0.21

 

0.21

Thermal Conductivity

ASTM F 433

W/M*K

0.22

W/M*K

0.22

Dimensional Stability(MD,10mil)

IPC-650 2.4.39(avg.after bake&thermal stress)

mils/inch

-0.038

 

-0.038

Dimensional Stability(CD,10mil)

IPC-650 2.4.39(avg.after bake&thermal stress)

mils/inch

-0.031

 

-0.031

Density(Specific Gravity)

ASTM D 792

g/cm3

2.19

g/cm3

2.19

CTE(X axis)(25-260℃)

ASTM D 3386(TMA)

ppm/℃

26

ppm/℃

26

CTE(Y axis)(25-260℃)

ASTM D 3386(TMA)

ppm/℃

15

ppm/℃

15

CTE(Z axis)(25-260℃)

ASTM D 3386(TMA)

ppm/℃

217

ppm/℃

217

NASA Outgassing(% TML)

 

 

0.01

 

0.01

NASA Outgassing(% CVCM)

 

 

0.01

 

0.01

NASA Outgassing(% WVR)

 

 

0.00

 

0.00

UL-94 Flammability Rating

UL-94

 

V-0

 

V-0

  PCBBACK TO NOVEMBER
 

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