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深圳市碧澄电子科技有限公司
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TLY-5Z High Frequency PCB

Introduction

Greetings, I'm Jane, the regional sales manager for Bicheng PCB. Our topic for discussion today is TLY-5Z PCBs, which are a type of high frequency PCB manufactured on lightweight substrates.

TLY-5Z laminates are advanced glass-filled PTFE composites reinforced with woven fiberglass. The glass-filled structure was created for low density applications with low weight constraints, such as aerospace.
This produces a dimensionally stable composite, which would not be achievable with non-reinforced PTFEs. The low density technique also results in a composite with a low Z axis expansion, which is not attainable with PTFE-rich composites.

This produces a dimensionally stable composite, which would not be achievable with non-reinforced PTFEs. The low density technique also results in a composite with a low Z axis expansion, which is not attainable with PTFE-rich composites.

TLY-5Z Typical Properties

TLY-5Z laminates exhibit a low dielectric constant and low dissipation factor of 2.2 and 0.0015 respectively at 10 GHz.

They also have good volume resistivity and surface resistivity, with values of 10^9 Mohms/cm and 10^8 Mohms respectively.

Additionally, TLY-5Z has a high dielectric breakdown voltage of 45 kV and a dielectric strength of 770 V/mil.

Compared to conventional 2.2 dielectric constant materials, TLY-5Z has a lower temperature coefficient of dielectric constant (TCDk) of -72 ppm/°C, ranging from -55 to 150°C. However, its thermal conductivity is relatively low at 0.2 W/m/K.

On the other hand, the coefficient of thermal expansion is pretty good. TLY-5Z has half the thermal expansion of PTFE-rich substrates, which allows for improved drilling and thermal cycling. It has 30 and 40 ppm/oC in the X and Y directions, and 130 ppm/oC in the Z-axis.

TLY-5Z laminates have excellent mechanical properties. They exhibit a peel strength of 7 lbs./inch for 1 oz copper and a tensile strength of over 9000 psi in both MD and CD directions. Tensile modulus in both directions exceeds 16000 psi, and they can elongate extension by 6% and 6.9%.
When it comes to flexural strength, TLY-5Z performs well, with 10300 psi and 11600 psi in the MD and CD directions respectively. Additionally, the flexural modulus is very high, with values topping 300 thousand and 400 thousand in the MD and CD directions respectively.
TLY-5Z has a negative dimensional stability nominal value of approximately -0.05% on 10 mils and 30 mils thicknesses evaluated after bake in the MD direction. When tested after thermal stress, it tends to express slightly more in the negative direction, with the value being -0.07% on both thicknesses.
TLY-5Z is a low-density laminate, with a density of 1.92 g/cm3. It has a specific heat value of 0.95 J/g/℃ and a low moisture absorption rate of 0.03%.
Finally, TLY-5Z has a Durometer hardness of 68 and is UL 94V-0 compatible.
 
 

Property

Conditions

Value

Unit

Test Method

Electrical properties

Dielectric Constant

@ 10 GHz

2.20+/- 0.04

IPC-650 2.5.5.5.1 Mod.

Dissipation Factor

@ 10 GHz

0.0015

IPC-650 2.5.5.5.1 Mod.

Volume Resistivity

10^9

Mohms/cm

IPC-650 2.5.17.1

Surface Resistivity

10^8

Mohms

IPC-650 2.5.17.1

Dielectric Breakdown Voltage

45

kV

IPC-650 2.5.6

Dielectric Strength

770

V/mil

IPC-650 2.5.6.2

Thermal properties

Tc(D)K

(-55 ~150°C)

-72

ppm/°C

IPC-650 2.5.5.6 Mod.

Thermal Conductivity

0.2

W/M*K

IPC-650 2.4.50

CTE (25 - 260°C)

X

30

ppm/ºC

IPC-650 2.4.41

Y

40

ppm/ºC

IPC-650 2.4.41

Z

130

ppm/ºC

IPC-650 2.4.41

Mechanical Properties

Peel Strength

1 oz. copper

7

lbs./inch

IPC-650 2.4.8

Tensile Strength

MD

9137

psi

IPC-650 2.4.18.3

CD

9572

psi

IPC-650 2.4.18.3

Tensile Modulus

MD

182,748

psi

IPC-650 2.4.18.3

CD

165,344

psi

IPC-650 2.4.18.3

Mechanical Properties

Elongation

MD

6

%

IPC-650 2.4.18.3

CD

6.9

%

IPC-650 2.4.18.3

Flex Strength

MD

10,300

psi

ASTM D790

CD

11,600

psi

ASTM D790

Flex Modulus

MD

377,100

psi

ASTM D790

CD

432,213

psi

ASTM D790

Dimensional Stability

MD

-0.05, -0.05

% (10mil, 30mil)

IPC-650 2.4.39 (Bake)

CD

-0.17,-0.11

% (10mil, 30mil)

IPC-650 2.4.39 (Bake)

Dimensional Stability

MD

-0.07, -0.07

% (10mil, 30mil)

IPC-650 2.4.39 (Stress)

CD

-0.22, -0.14

% (10mil, 30mil)

IPC-650 2.4.39 (Stress)

Density

Specific Gravity

1.92

g/cm3

IPC-650 2.3.5

Chemical / Physical Properties

Specific Heat

0.95

J/g°C

IPC-650 2.4.50

Moisture Absorption

0.03

%

IPC-650 2.6.2.1

Hardness

Durometer

68

-

ASTM D2240

UL-94 Flammability Rating

V-0

UL-94

 
Our PCB Capability (TLY-5Z)
For TLY-5Z PCB, we can provide you with double layer board, multi-layer board and hybrid designs.
The standard thickness such as 10 mils, 20 mils, 30 mils, 60mils etc are available in house. TLY-5Z can be custom-manufactured in increments of 10 mils (0.250mm).
Finished copper on track lines can be done with 1oz and 2oz.
Our maximum PCB size on high frequency materials is 400mm by 500mm, which can be a single board in the sheet or multiple designs in this panel.
Solder mask of green, black, blue, yellow and red is available in house.
Surface pads plating includes immersion gold, HASL, immersion silver, immersion tin, OSP, pure gold, ENEPIG and bare copper etc.
 
 

PCB Material:

Glass-filled PTFE composites with Woven Fiberglass Reinforcement.

Designation:

TLY-5Z

Dielectric Constant:

2.20 +/- 0.04 (10 GHz)

Dissipation Factor

0.0015 (10 GHz)

Layer Count:

Double Sided PCB, Multilayer PCB, Hybrid PCB

Laminate Thickness:

10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)

Copper Weight:

1oz (35 µm), 2oz (70µm)

PCB Size:

≤400mm X 500mm

Solder Mask:

Green, Black, Blue, Yellow, Red etc.

Surface Finish:

Immersion gold, Hot air soldering level (HASL), Immersion silver, Immersion tin, OSP, Pure gold plated, ENEPIG, Bare copper, etc..

 
A Piece of TLY-5Z PCB
A type of 60mil TLY-5Z printed circuit board with immersion silver for combiners is now displayed on the screen.
 
These boards can also be found in the applications of aerospace components, low weight antennas for aircraft and RF passive components etc.
Conclusion
TLY-5Z is also an attractive choice from a cost perspective. In comparison to traditional PTFE-rich copper clad laminates, the glass-filled structure offers a more cost-effective alternative. TLY-5Z can be employed in high-volume commercial microwave applications when PTFE-rich substrates are too expensive.
OK. This concludes today’s episode. Thank you for reading. See you next time.
 
 
 

 

 

 
 

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