TLX-8 PCB 2-layer 31mil

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TLX-8 PCB 2-layer 31mil with Immersion Gold

Shipped: 20th-Dec-2023

1. TLX-8 Introduction
TLX-8 is PTFE fiberglass laminates, a type of high volume antenna material which offers reliability in a wide range of RF applications. This material is versatile due to its wide range available thicknesses and copper cladding. It is suitable for low layer count microwave designs, offering mechanical reinforcementwherever a substrate experiences severe environments such as:
- Resistance to creep for PWBs bolted to a housing that encounters high levels of vibration during space launch
- High temperature exposure in engine modules
- Radiation resistance in space (see NASA’s website for low outgassing materials)
- Resistance to extreme environments at sea for warship antennas
- Resistance to a wide temperature range for altimeter substrates during flight

2. Benefits
- Excellent PIM Values in PCBs (measured at lower than -160 dBc*)
- Excellent Mechanical & Thermal Properties
- Low and Stable Dk
- Dimensionally Stable
- Low Moisture Absorption
- Tightly Controlled DK
- Low DF
- UL 94 V0 Rating
- For Low Layer Count Microwave Designs

3. Main Properties
- Electrical Properties
Dielectric Constant @ 10 GHz - 2.55 ± 0.04 - IPC-650 2.5.5.3
Dissipation Factor @ 10 GHz - 0.0018 - IPC-650 2.5.5.5.1

Surface Resistivity Elevated Temp. 6.605 x 10^8 Mohm IPC-650 2.5.17.1 Sec. 5.2.1
Surface Resistivity Humidity Cond. 3.550 x 10^6 Mohm IPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity Elevated Temp. 1.110 x 10^10 Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity Humidity Cond. 1.046 x 10^10 Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1

- Dimensional Stability
MD After Bake 0.06 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4
CD After Bake 0.08 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4
MD Thermal Stress 0.09 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5
CD Thermal Stress 0.10 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5

- CTE (25-260 °C)
X - 21 ppm/°C - IPC-650 2.4.41/ASTM D 3386
Y - 23 ppm/°C - IPC-650 2.4.41/ASTM D 3386
Z - 215 ppm/°C - IPC-650 2.4.41/ASTM D 3386

- Td
2% Weight Loss - 535 °C - IPC-650 2.4.24.6 (TGA)
5% Weight Loss - 553 °C - IPC-650 2.4.24.6 (TGA)

-Chemical / Physical Properties
Moisture Absorption - 0.02 % IPC-650 2.6.2.1
Dielectric Breakdown - > 45 Kv - IPC-650 2.5.6
Flammability Rating - V-0 - UL-94

4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Taconic TLX-8 Core - 0.787 mm (31mil)
Copper_layer_2 - 35 μm

5. PCB Construction details:
- Board dimensions: 111.54mm x 116.75 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 6/5 mils
- Minimum Hole Size: 0.25mm
- No Blind vias.
- Finished board thickness: 0.8mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

6. PCB Statistics:
Components: 27
Total Pads: 52
Thru Hole Pads: 28
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 56
Nets: 5

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:
- radar systems
- mobile communications
- microwave test equipment
- microwave transmission devices
- couplers, splitters, combiners, amplifiers, antennas

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