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深圳市碧澄电子科技有限公司
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Taconic TLX-0 High Frequency PCB Double Sided Boards 10mil 0.254mm Thickness

Shipped: 1st-Nov-2023  

We are thrilled to announce the arrival of one of TLX-0 PCBs, a game-changing solution that takes high-power RF and microwave applications to unprecedented levels of performance and reliability.

Introduction to TLX-0
TLX series laminates are crafted using PTFE fiberglass composites, providing exceptional reliability across a broad range of RF applications. This material exhibits versatility with its DK range of 2.45 - 2.65, various available thicknesses, and copper cladding options. It is particularly well-suited for low layer count microwave designs.

In the RF microwave substrate domain, TLX is renowned as a workhorse due to its fiberglass composition that offers mechanical reinforcement in demanding environments. Some examples include:
Withstanding creep in PCBs attached to housings experiencing high vibration levels during space launches.
Enduring high temperatures in engine modules.
Exhibiting radiation resistance in space applications (refer to NASA's website for low outgassing materials).
Resisting extreme environments at sea, making it ideal for warship antennas.
Maintaining stability across a wide temperature range, making it suitable for altimeter substrates during flight.

TLX-0 is one of the materials in the TLX series, featuring a dielectric constant of 2.45 with a tight tolerance of ± 0.04.

Key Features
Dielectric Constant (DK): 2.45 +/- 0.04 at 10GHz
Dissipation Factor: 0.0021 at 10GHz
Low Moisture Absorption: 0.02%
Coefficient of Thermal Expansion (CTE): X-axis: 21 ppm/°C, Y-axis: 23 ppm/°C, Z-axis: 215 ppm/°C
Peel Strength: 12 lbs/in

Benefits Excellent PIM (Passive Intermodulation) Values in PCBs (measured below -160 dBc) Outstanding Mechanical and Thermal Properties Low and Stable Dielectric Constant Dimensional Stability Minimal Moisture Absorption Precisely Controlled Dielectric Constant Low Dissipation Factor UL 94 V0 Rating Ideal for Low Layer Count Microwave Designs
PCB Stackup: 2-layer rigid PCB Copper Layer 1: 35 μm TLX-0 Core: 0.254 mm (10 mil) Copper Layer 2: 35 μm
PCB Construction Details: Board Dimensions: 80mm x 40.8mm (1 piece) with a tolerance of +/- 0.15mm Minimum Trace/Space: 6/7 mils Minimum Hole Size: 0.3mm No Blind Vias Finished Board Thickness: 0.32mm Finished Copper Weight: 1oz (1.4 mils) on outer layers Via Plating Thickness: 20 μm Surface Finish: Immersion Gold Top Silkscreen: None Bottom Silkscreen: None Top Solder Mask: None Bottom Solder Mask: None 100% Electrical Testing conducted prior to shipment
PCB Statistics: Components: 15 Total Pads: 38 Thru Hole Pads: 26 Top SMT (Surface Mount Technology) Pads: 12 Bottom SMT Pads: 0 Vias: 27 Nets: 3
Artwork Supplied: Gerber RS-274-X Quality Standard: IPC-Class-2 Availability: Worldwide
 
Typical Applications: Couplers, splitters, combiners, amplifiers, antennas, and passive components Radar systems and mobile communications Microwave test equipment Microwave transmission devices and RF components
Appendix: Dielectric Constant of TLX
 

Type

DK

TLY-5A

2.17

TLY-5

2.20

TLY-3

2.33

TLT-0

TLX-0

2.45

TLT-9

TLX-9

2.50

TLT-8

TLX-8

2.55

TLT-7

TLX-7

2.60

TLT-6

TLX-6

2.65

TLE-95

2.95

TLC-27

2.75

TLC-30

RF-30

3.00

TLC-32

3.20

TLF-35

3.50

TLF-35-xxxx-A

3.50

RF-35

RF-35A2

3.50

TRF-41

4.10

TRF-43

4.30

TRF-45

4.50

RF-60A

6.15

CER-10

10

  PCBBACK TO NOVEMBER
 

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