Rogers TC350 PCB Supplier

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Rogers TC350 RF PCB

Rogers' TC350 is a woven fiberglass reinforced, ceramic filled, PTFE based composite for use as making printed circuit board.TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

Features & Benefits:
1. The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. This results in reduced junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs.

2. TC350 has excellent Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes.

3. TC350 enjoys a strong bond to copper, utilizing microwave grade, low profile copper. This results in even lower insertion loss due to skin effect losses of copper that are more obvious at higher RF and microwave frequencies.

Typical Applications:
1. Microwave Combiner and Power Dividers
2. Power Amplifiers, Filters and Couplers
3. Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
4. Thermally Cycled Antennas sensitive to dielectric drift

Our PCB Capabilities (TC350)

PCB Material:	Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite
Designation:	TC350
Dielectric constant:	3.5±0.05
Thermal Conductivity	0.72 W/m-K
Dissipation Factor	Df .002@10 GHz
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 μm), 1oz (35μm), 2oz (70μm)
Laminate thickness:	10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin etc..

Typical Properties of TC350

Property	Units	Value	Test Merthod
1. Electrical Properties
Dielectric Constant (may vary by thickness)
@1 MHz	－	3.50	IPC TM-650 2.5.5.3
@1.8 GHz	－	3.50	RESONANT CAVITY
@10 GHz	－	3.50	IPC TM-650 2.5.5.5
Dissipation Factor
@1 MHz	－	0.0015	IPC TM-650 2.5.5.3
@1.8 GHz	－	0.0018	RESONANT CAVITY
@10 GHz	－	0.0020	IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric	－
TC r @ 10 GHz (-40-150°C)	ppm/oC	-9	IPC TM-650 2.5.5.5
Volume Resistivity
C96/35/90	MΩ-cm	7.4x10^6	IPC TM-650 2.5.17.1
E24/125	MΩ-cm	1.4x10^8
Surface Resistivity
C96/35/90	MΩ	3.2x10^7	IPC TM-650 2.5.17.1
E24/125	MΩ	4.3x10^8	IPC TM-650 2.5.17.1
Electrical Strength	Volts/mil (kV/mm)	780 (31)	IPC TM-650 2.5.6.2
Dielectric Breakdown	kV	40	IPC TM-650 2.5.6
Arc Resistance	sec	>240	IPC TM-650 2.5.1
2.Thermal Properties
Decomposition Temperature (Td)
Initial	°C	520	IPC TM-650 2.4.24.6
5%	°C	567	IPC TM-650 2.4.24.6
T260	min	>60	IPC TM-650 2.4.24.1
T288	min	>60	IPC TM-650 2.4.24.1
T300	min	>60	IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150oC	ppm/oC	7, 7	IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150oC	ppm/oC	12	IPC TM-650 2.4.24
% z-axis Expansion (50-260oC)	%	1.2	IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress	lb/in (N/mm)	7 (1.2)	IPC TM-650 2.4.8
At Elevated Temperatures (150oC)	lb/in (N/mm)	9 (1.6)	IPC TM-650 2.4.8.2
After Process Solutions	lb/in (N/mm)	7 (1.2)	IPC TM-650 2.4.8
Young’s Modulus	kpsi (MPa)		IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross)	kpsi (MPa)	14/10 (97/69)	IPC TM-650 2.4.4
Tensile Strength (Machine/Cross)	kpsi (MPa)	11/8 (76/55)	IPC TM-650 2.4.18.3
Compressive Modulus	kpsi (MPa)		ASTM D-3410
Poisson’s Ratio	－		ASTM D-3039
4. Physical Properties
Water Absorption	%	0.05	IPC TM-650 2.6.2.1
Density, ambient 23oC	g/cm3	2.30	ASTM D792 Method A
Thermal Conductivity	W/mK	0.72	ASTM D5470
Specific Heat	J/gK	0.90	ASTM D5470
Flammability	class	V0	UL-94
NASA Outgassing, 125oC, ≤10- 6 torr
Total Mass Loss	%	0.02	NASA SP-R-0022A
Collected Volatiles	%	0.01	NASA SP-R-0022A
Water Vapor Recovered	%	0.01	NASA SP-R-0022A