Rogers 6035 PCB Supplier

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Rogers RT/duroid 6035HTC RF PCB

RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications

Features/Benefits:

High Thermal conductivity

Improved dielectric heat dissipation enables lower operating temperatures for high power applications

Low loss tangent

Excellent high frequency performance

Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials

Some Typical Applications:

High Power RF and Microwave Amplifiers
Power Amplifiers, Couplers, Filters
Combiners, Power Dividers

PCB Capability（RT/duroid 6035HTC)

PCB Material:	Ceramic-filled PTFE composites
Designation:	RT/duroid 6035HTC
Dielectric constant:	3.50±0.05
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 μm), 1oz (35μm), 2oz (70μm)
Laminate thickness:	10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP etc..

Data Sheet of RT/duroid 6035HTC

Property	RT/duorid 6035HTC	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.50±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εProcess	3.50±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.6	Z		8 GHz - 40 GHz	Differential Phase Length Method
Dielectric Constant,εDesign	3.6	Z		8 GHz - 40 GHz	Differential Phase Length Method
Dissipation Factor	0.0013	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-66	Z	ppm/℃	-50 ℃to 150℃	mod IPC-TM-650, 2.5.5.5
Volume Resistivity	108		MΩ.cm	A	IPC-TM-650, 2.5.17.1
Surface Resistivity	108		MΩ	A	IPC-TM-650, 2.5.17.1
Dimensional Stability	-0.11 -0.08	CMD MD	mm/m (mils/inch)	0.030" 1oz EDC foil Thickness after etch '+E4/105	IPC-TM-650? 2.4.39A
Tensile Modulus	329 244	MD CMD	kpsi	40 hrs @23℃/50RH	ASTM D638
Moisure Absorption	0.06		%	D24/23	IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃)	19 19 39	X Y Z	ppm/℃	23℃ / 50% RH	IPC-TM-650 2.4.41
Thermal Conductivity	1.44		W/m/k	80℃	ASTM C518
Density	2.2		gm/cm3	23℃	ASTM D792
Copper Peel Stength	7.9		pli	20 sec. @288 ℃	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-Free Process Compatible	Yes

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