Rogers RO4533 PCB Supplier

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Rogers RO4533 High Frequency PCB

RO4533 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.3 and a loss tangent (Df) of 0.0025 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.

Features and Benefits
1. Low Loss 0.0025 , Low Dk 3.3, low PIM response: Wide range of application use
2. Thermoset resin system: Compatible with standard PCB fabrication
3. Excellent dimensional stability:? Greater yield on larger panels sizes
4. Uniform mechanical properties: Maintains mechanical form during handling
5. High thermal conductivity: Improved power handling

Typical Applications:
1. Cellular infrastructure base station antennas
2. WiMAX antenna networks

Our PCB Capabilities (RO4533)

PCB Material:	Ceramic-filled, Glass-reinforced Hydrocarbon
Designation:	RO4533
Dielectric constant:	3.3
Dissipation Factor	0.0025 10GHz
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 μm), 1oz (35μm), 2oz (70μm)
Laminate thickness:	20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

Typical value of RO4533

Property	RO4533	Direction	Units	Condition	Test Method
Dielectric Constant, er Process	3.3 ± 0.08	Z	-	10 GHz/23℃ 2.5 GHz	IPC-TM-650,2.5.5.5
Dissipation Factor	0.002	Z	-	2.5 GHz/23℃	IPC-TM-650, 2.5.5.5
Dissipation Factor	0.0025	Z	-	10 GHz/23℃	IPC-TM-650, 2.5.5.5
PIM (Typical)	-157	-	dBc	Reflected 43 dBm swept tones	Summitek 1900b PIM Analyzer
Dielectric Strength	>500	Z	V/mil	0.51 mm	IPC-TM-650, 2.5.6.2
Dimensional Stability	<0.2	X,Y	mm/m (mils/inch)	after etch	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion	13	X	ppm/℃	-55 to 288℃	IPC-TM-650, 2.4.41
	11	Y
	37	Z
Thermal Conductivity	0.6	-	W/(m.K)	80℃	ASTM C518
Moisture Absorption	0.02	-	%	D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Tg	>280	-	℃ TMA	A	IPC-TM-650, 2.4.24.3
Density	1.8	-	gm/cm3	-	ASTM D792
Copper Peel Strength	6.9 （1.2）	-	lbs/in (N/mm)	1 oz. EDC post solder float	IPC-TM-650, 2.4.8
Flammability	NON FR	-	-	-	UL 94
Lead-Free Process Compatible	Yes	-	-	-	-