We are delighted to share one of our newest arrival of RT/duroid 6035HTC PCBs, a revolutionary solution that takes high-power RF and microwave applications to new heights of performance and reliability.

Introducing RT/duroid 6035HTC:
Experience the exceptional capabilities of Rogers RT/duroid 6035HTC high-frequency circuit materials, specially designed for high-power RF and microwave applications. These ceramic filled PTFE composites offer outstanding performance and reliability in demanding high-power environments. With a thermal conductivity nearly 2.4 times that of standard RT/duroid 6000 products, and copper foil (ED and reverse treat) providing excellent long-term thermal stability, RT/duroid 6035HTC laminates are the ideal choice for high-power applications. Moreover, Rogers' advanced filler system ensures excellent drill-ability, reducing drilling costs compared to other high thermally conductive laminates that use alumina fillers.

Key Features:
Dielectric constant (DK) of 3.5 +/- 0.05 at 10 GHz/23°C.
Dissipation factor of 0.0013 at 10 GHz/23°C.
Thermal coefficient of dielectric constant (TCDk) of -66 ppm/°C.
Moisture absorption of 0.06%.
Thermal conductivity of 1.44 W/m/K at 80°C.
Coefficient of thermal expansion (CTE) in X-axis of 19 ppm/°C, Y-axis of 19 ppm/°C, and Z-axis of 39 ppm/°C.

Key Benefits:
High thermal conductivity enables efficient heat dissipation, resulting in lower operating temperatures for high-power applications.
Low loss tangent ensures excellent high-frequency performance.
Thermally stable low-profile and reverse treat copper foil contribute to lower insertion loss and excellent thermal stability of traces.
The advanced filler system improves drill-ability and extends tool life compared to circuit materials containing alumina.

PCB Stackup: 2-layer rigid PCB
Copper Layer 1: 35 μm
RT/duroid 6035HTC: 0.508 mm (20 mil)
Copper Layer 2: 35 μm

PCB Construction Details:
Board Dimensions: 200.5 mm x 41.5 mm (1PCS) with a tolerance of +/- 0.15 mm
Minimum Trace/Space: 4/6 mils
Minimum Hole Size: 0.3 mm
No blind vias are used in this design.
Finished Board Thickness: 0.6 mm
Finished Copper Weight: 1 oz (1.4 mils) on the outer layers
Via Plating Thickness: 20 μm
Surface Finish: Bare Copper, no additional surface finishes
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
Each PCB undergoes a 100% electrical test prior to shipment.

PCB Statistics:
Components: 26
Total Pads: 100
Thru Hole Pads: 58
Top SMT Pads: 42
Bottom SMT Pads: 0
Vias: 47
Nets: 5

Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: These PCBs are available worldwide, ensuring accessibility for customers globally.

Typical Applications:
High-power RF and microwave amplifiers
Power amplifiers, couplers, filters, combiners, power dividers

Appendix: RT/duroid 6035HTC Data Sheet