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Rogers RT/duroid 5880 High Frequency PCB Double Sided Boards 62mil 1.575mm Thickness

Shipped: 3rd-Nov-2023  

We are delighted to share one of our newest delivery of RT/duroid 5880 high-frequency PCBs integrated with Rogers' state-of-the-art laminates. These remarkable PCBs are poised to redefine the industry landscape by delivering exceptional performance and unrivaled reliability.

Introducing RT/duroid 5880:
Rogers RT/duroid 5880 high-frequency laminates are composed of PTFE composites reinforced with glass microfibers, offering a low dielectric constant (Dk) and minimal dielectric loss. Designed for high-frequency and broadband applications, RT/duroid 5880 laminates ensure Dk uniformity with the help of randomly oriented microfibers reinforcing the PTFE composites.

Key Features:
Benefit from a dielectric constant of 2.2 with a tight tolerance of 0.02 at 10 GHz/23°C.
Enjoy a dissipation factor of 0.0009 at 10 GHz, minimizing signal loss.
Experience a temperature coefficient of dielectric constant (TCDk) of -125 ppm/°C, ensuring stability across temperature variations.
With a low moisture absorption of only 0.02%, these laminates excel in high-moisture environments.
The coefficient of thermal expansion (CTE) values are as follows: X-axis - 31 ppm/°C, Y-axis - 48 ppm/°C, and Z-axis - 237 ppm/°C.
RT/duroid 5880 laminates exhibit isotropic properties, guaranteeing uniform electrical performance.

Key Benefits:
Enjoy consistent and uniform electrical properties over a wide frequency range.
Easily cut, shape, and machine these laminates to meet your design requirements.
Experience resistance to solvents and reagents used in etching or plating processes, ensuring durability.
RT/duroid 5880 laminates are ideal for high-moisture environments, providing reliability in challenging conditions.
Trust in the reliability of this well-established material with the lowest electrical loss among reinforced PTFE materials.

PCB Stackup: 2-layer rigid PCB
Copper Layer 1: 35 μm
RT/duroid 5880: 1.575 mm (62 mil)
Copper Layer 2: 35 μm

PCB Construction Details:
Board Dimensions: 106 mm x 106 mm (1PCS), with a tolerance of +/- 0.15 mm
Minimum Trace/Space: 5/6 mils
Minimum Hole Size: 0.4 mm
No blind vias are used in this design.
Finished Board Thickness: 1.6 mm
Finished Copper Weight: 1 oz (1.4 mils) on the outer layers
Via Plating Thickness: 20 μm
Surface Finish: Bare Copper
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
Each PCB undergoes a 100% electrical test before shipment.

PCB Statistics:
Components: 10
Total Pads: 33
Thru Hole Pads: 21
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 9
Nets: 2

Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: These PCBs are available worldwide, ensuring accessibility for customers globally.

Typical Applications:
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Applications
Radar Systems
Guidance Systems
Point-to-Point Digital Radio Antennas
Appendix: RT/duroid 5880 Data Sheet
 

RT/duroid 5880 Typical Value

Property

RT/duroid 5880

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.20
2.20±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.2

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0004
0.0009

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-125

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23）

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23℃

Test at 100℃

N/A

MPa(kpsi)

A

ASTM D 638

 

1070(156)

450(65)

X

 

 

 

 

860(125)

380(55)

Y

 

 

 

Ultimate Stress

29(4.2)

20(2.9)

X

 

 

 

 

27(3.9）

18(2.6)

Y

 

 

 

Ultimate Strain

6

7.2

X

%

 

 

 

4.9

5.8

Y

 

 

 

Compressive Modulus

710(103)

500(73)

X

MPa(kpsi)

A

ASTM D 695

 

710(103)

500(73)

Y

 

 

 

 

940(136)

670(97)

Z

 

 

 

Ultimate Stress

27(3.9)

22(3.2)

X

 

 

 

 

29(5.3)

21(3.1)

Y

 

 

 

 

52(7.5)

43(6.3)

Z

 

 

 

Ultimate Strain

8.5

8.4

X

%

 

 

 

7.7

7.8

Y

 

 

 

 

12.5

17.6

Z

 

 

 

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.2

Z

W/m/k

80℃

ASTM C 518

Coefficient of Thermal Expansion

31
48
237

X
Y
Z

ppm/℃

0-100℃

IPC-TM-650 2.4.41

Td

500

N/A

℃?TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

31.2(5.5)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A

  PCBBACK TO NOVEMBER
　

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