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RT/duroid 5880LZ High Frequency PCB

Introduction

Today, let’s talk about a type of lightweight high frequency circuit board: RT/duroid 5880LZ PCB.

 

Rogers RT/duroid 5880LZ laminates are filled PTFE composites designed for exacting strip-line and micro-strip circuit applications. They contain a unique filler that results in a low density, lightweight material for high performance and weight sensitive applications.
 
RT/duroid 5880LZ Typical Properties
RT/duroid 5880LZ is an impressive material that offers a range of outstanding properties. Let's take a closer look at some of its key features.
 

First and foremost, let's discuss the dielectric constant of RT/duroid 5880LZ. It has a process value of 2.00 ± 0.04 at 10 GHz and 23°C, ensuring reliable signal transmission in the Z direction, as per IPC-TM-650, 2.5.5.5.

 
The design dielectric constant is also 2.00 in the Z direction, covering a frequency range from 8 GHz to 40 GHz, as determined by the differential phase length method.

 

The dissipation factor, also known as tan delta, is impressively low, with a typical value of 0.0021 and a maximum of 0.0027 at 10 GHz and 23°C. This indicates minimal signal loss and excellent performance.

 
RT/duroid 5880LZ exhibits a thermal coefficient of dielectric constant of +20 ppm/°C in the Z direction, from -50°C to 150°C at 10 GHz, as specified by IPC-TM-650, 2.5.5.5. This ensures stable performance across a wide temperature range.

 

In terms of electrical properties, RT/duroid 5880LZ demonstrates a volume resistivity of 1.74 x 10^7 Mohm?cm and a surface resistivity of 2.08 x 10^6 Mohm, as tested under C-96/35/90 conditions, according to IPC-TM-650, 2.5.17.1.

 

The electrical strength of RT/duroid 5880LZ is measured at 40 KV, ensuring its durability and reliability in demanding applications, as per D48/50 specifications in IPC-TM-650, 2.5.6.

 

When it comes to dimensional stability, RT/duroid 5880LZ showcases a remarkable performance with a dimensional change of -0.38% in the X and Y directions, ensuring consistent and reliable performance, as tested under IPC-TM-650, 2.4.39A.

 

The moisture absorption of RT/duroid 5880LZ is 0.31% after 24 hours at 23°C, indicating its ability to resist moisture penetration, as specified by IPC-TM-650, 2.6.2.1.
 
RT/duroid 5880LZ exhibits a thermal conductivity of 0.33 W/m/°K in the Z direction at 80°C as tested by ASTM C518.
 
The coefficient of thermal expansion of RT/duroid 5880LZ is 54 ppm/°C in the X direction, 47 ppm/°C in the Y direction, and 40 ppm/°C in the Z direction, from 0°C to 150°C, ensuring dimensional stability under varying temperature conditions, according to IPC-TM-650, 2.4.41.
 
RT/duroid 5880LZ has undergone rigorous testing for outgassing, meeting the requirements of ASTM E-595, with low values for Total Mass Loss (TML), Collected Volatile Condensable Materials (CVCM), and Water Vapor Regain (WVR), all at 0.01%.
 

The material has a density of 1.4 gm/cm^3, providing a lightweight yet robust solution for high-frequency applications, as determined by ASTM D792.

The copper peel strength of RT/duroid 5880LZ is greater than 4.0 pli, ensuring excellent adhesion and reliability in copper bonding processes, as tested under IPC-TM-650, 2.4.8.

RT/duroid 5880LZ has achieved a V-O rating for flammability according to UL 94, ensuring its resistance to ignition and flame propagation.

Lastly, RT/duroid 5880LZ is compatible with lead-free processes, offering a reliable and environmentally friendly solution for your electronic applications.

 
 

Property

RT/duroid 5880LZ

Direction

Units

Condition

Test Method

Dielectric Constant er,Process

2.00 ± 0.04

Z

 

10 GHz/23°C

IPC-TM-650, 2.5.5.5

Dielectric Constant er,Design

2.00

Z

 

8 GHz - 40 GHz

Differential Phase Length Method

Dissipation Factor, tan

Typ: 0.0021

Max: 0.0027

Z

 

10GHz/23°C

IPC-TM-650, 2.5.5.5

Thermal Coefficient of Dielectric Constant, er

+20

Z

ppm/°C

-50°C to 150°C 10GHz

IPC-TM-650, 2.5.5.5

Volume Resistivity

1.74 X 10^7

 

Mohm•cm

C-96/35/90

IPC-TM-650, 2.5.17.1

Surface Resistivity

2.08 X 10^6

 

Mohm

C-96/35/90

IPC-TM-650, 2.5.17.1

Electrical Strength

40

 

KV

D48/50

IPC-TM-650, 2.5.6

Dimensional Stability

-0.38

X,Y

%

 

IPC-TM-650, 2.4.39A

Moisture Absorption

0.31

 

%

24 hours/23°C

IPC-TM-650, 2.6.2.1

Thermal Conductivity

0.33

Z

W/m/°K

80°C

ASTM C518

Coefficient of Thermal Expansion

54,47,40

X,Y,Z

ppm/°C

0 to 150°C

IPC-TM-650, 2.4.41

Outgassing

 

 

 

 

TML

0.01

 

%

 

ASTM E-595

CVCM

0.01

 

 

 

WVR

0.01

 

 

 

Density

1.4

 

gm/cm^3

 

ASTM D792

Copper Peel

>4.0

 

pli

 

IPC-TM-650, 2.4.8

Flammability

V-O

 

 

 

UL 94

Lead-Free Process Compatible

YES

 

 

 

 
PCB Capability (RT/duroid 5880LZ)
For RT/duroid 5880LZ PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. RT/duroid 5880LZ PCBs have wide thickness. These are the standard thickness such as 10 mils, 20 mils, 50 mils and 100mils for our designers.
 
Finished copper on PCB is 1oz and 2oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.
 
Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, immersion silver, immersion tin, bare copper etc. for pads plating.
 
 

PCB material:

Unique Filled PTFE Composites

Designation:

RT/Duroid 5880LZ

Dielectric constant:

2

Dissipation factor

0.0021 10GHz

Layer count:

1-layer, 2-layer, multi-layer, hybrid designs

Laminate thickness:

10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm ?)

Copper weight:

1oz (35µm), 2oz (70 µm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Immersion gold, Immersion silver, Immersion tin, ENEPIG, Bare copper, HASL, OSP, Pure gold plated etc..

 
A Piece of RT/duroid 5880LZ PCB
Now what we are seeing on the screen is a type of 20mil RT/duroid 5880LZ PCB with immersion gold, a double layer board. In our lives, we can find their typical applications in the area of airborne antenna system, lightweight feed networks, point-to-point digital radio antennas etc.
 
 
 
Conclusion

RT/duroid 5880LZ has Z-axis coefficient of thermal expansion (CTE) at 40 ppm/°C. This is a low value that ensure its reliable plated through holes.

When ordering RT/duroid 5880LZ PCB, it is important to specify the dielectric thickness, weight of copper foil required and surface finish.

 
OK. This concludes today’s episode. Thank you for reading. See you next time.
 
 
 

 

 

 
 

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