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Rogers RT/duroid 5870 High Frequency PCB Double Sided Circuits 5mil 0.127mm Thickness

Shipped: 10th-Nov-2023  

We delighted to announce the arrival of our most recent batch of high-frequency PCBs featuring the groundbreaking RT/duroid 5870 laminates by Rogers. These exceptional laminates are revolutionizing the industry with their outstanding performance and reliability.

RT/duroid 5870 Introduction
Rogers presents the remarkable RT/duroid 5870 high-frequency laminates, which are composite materials made of PTFE reinforced with glass microfibers. These laminates excel in high-frequency applications, boasting a low dielectric constant (Dk). The incorporation of randomly oriented microfibers ensures exceptional Dk uniformity. With their low Dk loss, RT/duroid 5870 laminates are the perfect choice for minimizing dispersion and losses in high-frequency and broadband applications.

Key Features:
Dielectric constant of 2.33 with a tight tolerance of 0.02 at 10 GHz/23°C
Dissipation factor of 0.0012 at 10 GHz
Temperature coefficient of dielectric constant (TCDk) of -115 ppm/°C
Low moisture absorption of 0.02%
Coefficient of thermal expansion (CTE): X-axis - 22 ppm/°C, Y-axis - 28 ppm/°C, Z-axis - 173 ppm/°C
Isotropic

Benefits:
Lowest electrical loss among reinforced PTFE materials
Easy cutting, shaping, and machining capabilities
Resistant to solvents and reagents used in etching or plating processes
Well-suited for high moisture environments
Established material with a proven track record
Uniform electrical properties across a wide frequency range

PCB Stackup: 2-layer rigid PCB
Copper layer 1: 35 μm
RT/duroid 5870: 0.127 mm (5 mil)
Copper layer 2: 35 μm

PCB Construction Details:
Board dimensions: 60.8 mm x 60.8 mm (1PCS), +/- 0.15 mm
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.2 mm
No blind vias
Finished board thickness: 0.2 mm
Finished Cu weight: 1oz (1.4 mils) outer layers
Via plating thickness: 20 μm
Surface finish: Immersion gold
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
100% Electrical test conducted prior to shipment

PCB Statistics:
Components: 8
Total Pads: 19
Thru Hole Pads: 10
Top SMT Pads: 9
Bottom SMT Pads: 0
Vias: 7
Nets: 2

Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

Typical Applications:
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Applications
Radar Systems
Guidance Systems
Point-to-Point Digital Radio Antennas

Appendix: RT/duroid 5870 Data Sheet

 

RT/duroid 5870 Typical Value

Property

RT/duroid 5870

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.33
2.33±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.33

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0005
0.0012

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-115

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23)

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23℃

Test at 100℃

N/A

MPa(kpsi)

A

ASTM D 638

 

1300(189)

490(71)

X

 

 

 

 

1280(185)

430(63)

Y

 

 

 

Ultimate Stress

50(7.3)

34(4.8)

X

 

 

 

 

42(6.1)

34(4.8)

Y

 

 

 

Ultimate Strain

9.8

8.7

X

%

 

 

 

9.8

8.6

Y

 

 

 

Compressive Modulus

1210(176)

680(99）

X

MPa(kpsi)

A

ASTM D 695

 

1360(198)

860(125)

Y

 

 

 

 

803(120)

520(76)

Z

 

 

 

Ultimate Stress

30(4.4)

23(3.4）

X

 

 

 

 

37(5.3)

25(3.7)

Y

 

 

 

 

54(7.8)

37(5.3)

Z

 

 

 

Ultimate Strain

4

4.3

X

%

 

 

 

3.3

3.3

Y

 

 

 

 

8.7

8.5

Z

 

 

 

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.22

Z

W/m/k

80℃

ASTM C 518

Coefficient of Thermal Expansion

22
28
173

X
Y
Z

ppm/℃

0-100℃

IPC-TM-650 2.4.41

Td

500

N/A

℃?TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

27.2(4.8)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A

  PCBBACK TO NOVEMBER
　

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