RO4730G3 20mil PCB| Bicheng PCB

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RO4730G3 2-layer 20mil 0.508mm High Frequency PCB

Shipped: 18th-Dec-2023

1. RO4730G3 Introduction Rogers RO4730G3 is hydrocarbon / ceramic / woven glass UL 94 V-0 antenna grade laminates that are a reliable, low-cost alternative to conventional PTFE-based laminates. The resin systems of RO4730G3 dielectric materials provide the necessary properties for ideal antenna performance. RO4730G3 antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4730G3 laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing for designers to optimize cost and performance.

2. Features - Dk of 3.0 +/- 0.05 at 10GHz - Dissipation factor of .0028 at 10GHz - Thermal coefficient of Dk of 34 ppm/°C - Coefficient of thermal expansion matched to copper - Tg >280 °C - Decomposition Temperature (Td) of 411 °C TGA - Coefficient of Thermal Expansion - x y z : 15.9 ppm/°C, 14.4 ppm/°C, 35.2 ppm/°C - Thermal Conductivity of 0.45W/mk

3. Benefits - low loss dielectric with low profile foil * Reduced PIM * Low insertion loss

- Unique filler / closed microspheres * Low density * Light-weight 30% lighter than PTFE / Glass

- Low Z-axis CTE <30ppm/°C - High Tg >280°C * Design flexibility * Automated assembly compatible

- Low TCDk <40 ppm/°C * Consistent circuit performance

- Specially formulated thermoset resin system/filler * Low TCDk * 3.0 Dk * Ease of fabrication * PTH process capability

- Environmentally Friendly * Lead-free process compatibility * RoHS compliant

4. PCB Stackup: 2-layer rigid PCB Copper_layer_1 - 35 μm Rogers RO4730G3 Core - 0.508 mm (20mil) Copper_layer_2 - 35 μm

5. PCB Construction details: - Board dimensions: 150mm x 110 mm=7Types=8PCS, +/- 0.15mm - Minimum Trace/Space: 4/6 mils - Minimum Hole Size: 0.25mm - No Blind vias. - Finished board thickness: 0.6mm - Finished Cu weight: 1oz (1.4 mils) outer layers - Via plating thickness: 20 μm - Surface finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) - Top Silkscreen: No - Bottom Silkscreen: No - Top Solder Mask: Green - Bottom Solder Mask: Green - 100% Electrical test used prior to shipment

6. PCB Statistics: Components: 29 Total Pads: 38 Thru Hole Pads: 22 Top SMT Pads: 16 Bottom SMT Pads: 0 Vias: 17 Nets: 6

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications: - Cellular Base Station Antennas

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