RO4360G2 High Frequency PCB

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Introduction

Today, we’re going to talk about Rogers’ first high dielectric constant PCB --- RO4360G2 high frequency PCB.

RO4360G2 PCB is glass-reinforced, hydrocarbon ceramic-filled thermoset printed circuit board that provides the ideal balance of performance, and manufacturability is similar to FR-4 PCB. They are lead-free process capable and have better rigidity in multi-layer board constructions, while reducing material and fabrication costs.

RO4360G2 Typical Properties

RO4360G2 is an impressive material that offers a range of outstanding properties. Let's take a closer look at some of its key features.

First and foremost, let's discuss the dielectric constant of RO4360G2. With a process value of 6.15±0.15 at 10 GHz and 23°C, this material ensures reliable signal transmission. It also maintains a dielectric constant of 6.15 at 2.5 GHz and 23°C.

The dissipation factor, also known as tan delta, is impressively low at 0.0038 at 10 GHz and 23°C. This indicates minimal signal loss and excellent performance.

RO4360G2 exhibits a thermal conductivity of 0.75 W/mK at 50°C, allowing for efficient heat dissipation in electronic systems.

In terms of electrical properties, RO4360G2 demonstrates high volume resistivity, measuring 4.0 x 10^13 Ω.cm at elevated temperatures. It also exhibits a surface resistivity of 9.0 x 10^12 Ω at elevated temperatures, enhancing its electrical insulation capabilities.

The electrical strength of RO4360G2 is an impressive 784 V/mil, ensuring its durability and reliability in demanding applications.

Moving on to mechanical properties, RO4360G2 showcases a tensile strength of 131 MPa (19 kpsi) in the X direction and 97 MPa (14 kpsi) in the Y direction after 40 hours at 50% relative humidity and 23°C, as per ASTM D638.

The flexural strength of RO4360G2 measures 213 MPa (31 kpsi) in the X direction and 145 MPa (21 kpsi) in the Y direction after 40 hours at 50% relative humidity and 23°C, according to IPC-TM-650, 2.4.4.

When it comes to thermal properties, RO4360G2 exhibits a coefficient of thermal expansion of 13 ppm/°C along the X axis, 14 ppm/°C along the Y axis, and 28 ppm/°C along the Z axis, from -50°C to 288°C after a replicated heat cycle, as per IPC-TM-650, 2.1.41.

The glass transition temperature (Tg) of RO4360G2 is greater than 280°C, as determined by TMA according to IPC-TM-650 2.4.24.3. The material also has a thermal decomposition temperature (Td) of 407°C, as measured by ASTM D3850 using TGA.

RO4360G2 showcases a T288 value of greater than 30 minutes in the Z direction, at a minimum temperature of 125°C during prebake, as per IPC-TM-650 2.2.24.1.

With a moisture absorption of 0.08% at 50°C and 48 hours, RO4360G2 demonstrates excellent resistance to moisture penetration, as tested using IPC-TM-650 2.6.2.1 and ASTM D570.

The thermal coefficient of the dielectric constant (er) for RO4360G2 is -131 ppm/°C at 10 GHz in the Z direction, from -50°C to 150°C, as specified by IPC-TM-650 2.5.5.5. RO4360G2 has a density of 2.16 gm/cm3 at room temperature, providing a lightweight yet robust material for electronic applications.

The copper peel strength of RO4360G2 measures 5.2 pli (0.91 N/mm) under Condition B, as tested according to IPC-TM-650 2.4.8.

Lastly, RO4360G2 has achieved the V-0 rating for flammability according to UL 94 File QMTS2. E102765, ensuring its resistance to ignition and flame propagation.

Property	RO4360G2	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	6.15±0.15	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Dielectric Constant,εProcess	6.15±0.15	Z		2.5 GHz/23℃	IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ	0.0038	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Conductivity	0.75		W/mK	50℃	ASTM D-5470
Volume Resistivity	4.0 X 10^13		Ω.cm	Elevated T	IPC-TM-650 ?2.5.17.1
Surface Resistivity	9.0 X 10^12		Ω	Elevated T	IPC-TM-650 ?2.5.17.1
Electrical Strength	784	Z	V/mil		IPC-TM-650 ?2.5.6.2
Tensile Strength	131(19) 97(14)	X Y	MPa (kpsi)	40 hrs 50%RH/23	ASTM D638
Flexural Strength	213(31) 145(21)	X Y	Mpa (kpsi)	40 hrs 50%RH/23	IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion	13 14 28	X Y Z	ppm/℃	-50 ℃to 288℃ After Replicated Heat Cycle	IPC-TM-650, 2.1.41
Tg	>280		℃ TMA		IPC-TM-650 2.4.24.3
Td	407		℃		ASTM D3850 using TGA
T288	>30	Z	min	30 min / 125℃ Prebake	IPC-TM-650 2.2.24.1
Moisure Absorption	0.08		%	50℃/48hr	IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er	-131 @10 GHz	Z	ppm/℃	-50℃ to 150 ℃	IPC-TM-650, 2.5.5.5
Density	2.16		gm/cm3	RT	ASTM D792
Copper Peel Stength	5.2 (0.91)		pli (N/mm)	Condtion B	IPC-TM-650 2.4.8
Flammability	V-0				UL 94 File QMTS2. E102765

PCB Capability (RO4360G2)

For RO4360G2 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. RO4360G2 PCBs have wide thickness. There are the standard thickness such as 12 mils, 20 mils, 32 mils, 60 mils etc. and non-standard thickness such as 8 mils, 16 mils, 24 mils etc.

Finished copper on PCB can be 1oz, 2oz and 3oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.

Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper etc. for pads plating.

PCB Material:	Hydrocarbon Ceramic-filled Thermoset Materials
Designation:	RO4360G2
Dielectric constant:	6.15 ±0.15
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm), 3oz (105µm)
Laminate thickness:	8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Immersion Gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP etc..

A Piece of RO4360G2 PCB

On the screen is a type of 60 mils RO4360G2 PCB with immersion gold on pads for small cell transceivers. There are 20 boards in the panel. RO4360G2 PCBs are the best choice for engineers working on power amplifiers, patch antennas, ground-based radar, base station power amplifiers, and other general RF applications.

Conclusion

RO4360G2 PCBs are automated assembly compatible and lead free process compatible with reliable plated through holes.They can be paired with RO4450F prepreg and lower-Dk RO4350B, RO4003C in multi-layer designs.

Well. That’s today’s episode. Thank you for reading. See you next time.