We are thrilled to announce the arrival of our latest shipment of high-frequency PCBs featuring the outstanding RO4350B material. These PCBs offer exceptional performance and cost-effectiveness, making them an excellent choice for your electronic design needs.

Introduction to RO4350B:
RO4350B laminates from Rogers are a cutting-edge solution that combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. These proprietary laminates offer precise control over dielectric constant (Dk) and maintain low loss while utilizing standard epoxy/glass processing methods. With a significantly lower cost compared to traditional microwave laminates, RO4350B laminates eliminate the need for special treatments or handling procedures associated with PTFE-based materials. Moreover, they are UL 94 V-0 rated, making them suitable for active devices and high-power RF designs

Key Features:
Dielectric Constant (DK): 3.48 +/- 0.05 at 10GHz
Dissipation Factor: 0.0037 at 10GHz
Thermal Conductivity: 0.69 W/m/°K
X-axis Coefficient of Thermal Expansion (CTE): 10ppm/°C
Y-axis CTE: 12ppm/°C
Z-axis CTE: 32ppm/°C
Tg (Glass Transition Temperature): >280 °C
Operating Temperature Range: -40℃ to +85℃

Key Benefits:
Low dielectric tolerance and low loss
Enables applications with higher operating frequencies
Ideal for broadband applications

Stable Electrical Properties vs. Frequency:
Controlled impedance transmission lines
Consistent design of filters

Low thermal coefficient of dielectric constant
Ensures excellent dimensional stability

Low Z-axis expansion
Ensures reliable plated through holes

Low in-plane expansion coefficient
Maintains stability during circuit processing

Cost-Effective Volume Manufacturing
Can be fabricated using standard glass epoxy processes
Competitive pricing

CAF (Conductive Anodic Filament) Resistant

PCB Stackup: 2-layer rigid PCB
Copper layer 1: 35 μm
Rogers 4350B Core: 0.254 mm (10mil)
Copper layer 2: 35 μm

PCB Construction Details:
Board Dimensions: 53.18mm x 56.04 mm (1PCS), +/- 0.15mm
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.25mm
No Blind vias
Finished Board Thickness: 0.32mm
Finished Cu Weight: 1oz (1.4 mils) outer layers
Via Plating Thickness: 20 μm
Surface Finish: Immersion silver
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
100% Electrical Test used prior to shipment

PCB Statistics:
Components: 11
Total Pads: 70
Thru Hole Pads: 47
Top SMT Pads: 23
Bottom SMT Pads: 0
Vias: 79
Nets: 3

Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide

ypical Applications:
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites

Appendix: RO4350B Data Sheet