Rogers 4003C PCB 32mil 1200mm

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Rogers RO4003C 2-layer 32mil 0.813mm 1200mm Long High Frequency PCB

Shipped: 6th-Dec-2023

1. RO4003C Introduction Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles with all configurations meeting the same laminate electrical performance specification. RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required.

RO4003C materials are non-brominated and are not UL 94 V-0 rated.

2. Features - Rogers RO4003C woven glass reinforced hydrocarbon/ceramics - Dielectric Constant of DK 3.38 +/-0.05 at 10GHz - Dissipation Factor of 0.0027 at 10GHz - Thermal Conductivity 0.71 W/m/°K - X axis CTE of 11ppm/°C, Y CTE of 14ppm/°C, Z CTE of 46ppm/°C - Tg >280 °C - -40℃ to +85℃ operation

3. Benefits: - Low dielectric tolerance and low loss * Excellent electrical performance * Allows applications with higher operating frequencies * Ideal for broadband applications

- Stable electrical properties vs. frequency * Controlled impedance transmission lines * Repeatable design of filters

- Low thermal coefficient of dielectric constant * Excellent dimensional stability

- Low Z-axis expansion * Reliable plated through holes

- Low in-plane expansion coefficient * Remains stable over an entire range of circuit processing temperatures

- Volume manufacturing process * RO4003C laminates can be fabricated using standard glass epoxy processes * Competitively priced

- CAF resistant

4. PCB Stackup: 2-layer rigid PCB Copper_layer_1 - 35 μm Rogers 4003C Core - 0.813 mm (32mil) Copper_layer_2 - 35 μm

5. PCB Construction details: - Board dimensions: 1200mm x 300 mm=1PCS, +/- 0.15mm - Minimum Trace/Space: 6/6 mils - Minimum Hole Size: 0.5mm - No Blind vias. - Finished board thickness: 0.9mm - Finished Cu weight: 1oz (1.4 mils) outer layers - Via plating thickness: 20 μm - Surface finish: Immersion Gold - Top Silkscreen: Black - Bottom Silkscreen: No - Top Solder Mask: No - Bottom Solder Mask: No - 100% Electrical test used prior to shipment

6. PCB Statistics: Components: 51 Total Pads: 232 Thru Hole Pads: 171 Top SMT Pads: 61 Bottom SMT Pads: 0 Vias: 120 Nets: 4

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications: - Cellular Base Station Antennas and Power Amplifiers - RF Identification Tags - Automotive Radar and Sensors - LNB's for Direct Broadcast Satellites

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