RO4003C High Frequency PCB Supplier

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RO4003C High Frequency PCB Double Sided Circuits 32mil 0.813mm Thickness

Shipped: 4th-Nov-2023

We are thrilled to share a type of the latest addition to our PCB lineup, the RO4003C PCB. These exceptional PCBs offer a multitude of features and benefits that will take your electronic designs to the next level.

Introduction to RO4003C:

RO4003C laminates are available in various configurations, utilizing 1080 and 1674 glass fabric styles. All configurations meet the same electrical performance specification. These laminates provide precise control over dielectric constant (Dk) and offer low loss, while employing a processing method similar to standard epoxy/glass laminates at a fraction of the cost of traditional microwave laminates. Unlike PTFE-based microwave materials, no special through-hole treatments or handling procedures are necessary. RO4003C materials are non-brominated and do not have a UL 94 V-0 rating.

Features:

Rogers RO4003C laminates with woven glass reinforcement and hydrocarbon/ceramics
Dielectric Constant (DK): 3.38 +/- 0.05 at 10GHz
Dissipation Factor: 0.0027 at 10GHz
Thermal Conductivity: 0.71 W/m/°K
X-axis Coefficient of Thermal Expansion (CTE): 11ppm/°C
Y-axis CTE: 14ppm/°C
Z-axis CTE: 46ppm/°C
Tg (Glass Transition Temperature): >280 °C
Operating Temperature Range: -40℃ to +85℃

Benefits:
Low dielectric tolerance and low loss
Excellent electrical performance
Suitable for higher operating frequencies
Ideal for broadband applications

Stable electrical properties across frequencies
Controlled impedance transmission lines
Consistent design of filters

Low thermal coefficient of dielectric constant
Excellent dimensional stability

Low Z-axis expansion
Reliable plated through holes

Low in-plane expansion coefficient
Remains stable over a wide range of circuit processing temperatures

Volume manufacturing process
RO4003C laminates can be fabricated using standard glass epoxy processes
Competitive pricing

CAF (Conductive Anodic Filament) resistant

Stackup: 2-layer rigid PCB
Copper layer 1: 35 μm
Rogers 4003C Core: 0.813 mm (32mil)
Copper layer 2: 35 μm

PCB Construction details:
Board dimensions: 265mm x 66.88mm (2 Types = 2PCS), +/- 0.15mm
Minimum Trace/Space: 6/5 mils
Minimum Hole Size: 0.35mm
No Blind vias.
Finished board thickness: 0.9mm
Finished Cu weight: 1oz (1.4 mils) outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Gold
Top Silkscreen: White
Bottom Silkscreen: White
Top Solder Mask: Green
Bottom Solder Mask: Green
100% Electrical test used prior to shipment

PCB Statistics:
Components: 66
Total Pads: 153
Thru Hole Pads: 81
Top SMT Pads: 72
Bottom SMT Pads: 0
Vias: 120
Nets: 4

Artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide

Some Typical Applications:
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNB's for Direct Broadcast Satellites

Appendix: RO4003C Data sheet

RO4003C Typical Value
Property	RO4003C	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.38±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.55	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0027 0.0021	Z		10 GHz/23℃ 2.5 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+40	Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 x 1010		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 x 109		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	19,650(2,850) 19,450(2,821)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	139(20.2) 100(14.5)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	276 (40)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X,Y	mm/m (mil/inch)	after etch+E2/150℃	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	11 14 46	X Y Z	ppm/℃	-55℃to288℃	IPC-TM-650 2.4.41
Tg	>280		℃?TMA	A	IPC-TM-650 2.4.24.3
Td	425		℃?TGA		ASTM D 3850
Thermal Conductivity	0.71		W/M/oK	80℃	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50℃	ASTM D 570
Density	1.79		gm/cm3	23℃	ASTM D 792
Copper Peel Stength	1.05 (6.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	N/A				UL 94
Lead-free Process Compatible	Yes

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