RO3010 PCB 10MIL | Bicheng PCB

WELCOME TO BICHENG

Rogers RO3010 High Frequency PCB Double Sided Board 10mil 0.254mm Thickness

Shipped: 15th-Nov-2023

We are delighted to introduce a type of our newest RO3010 PCBs, a cutting-edge circuit board that will revolutionize your approach to electronic design with unparalleled stability, exceptional performance, and a wide range of applications, offering incredible features and benefits for your next project.

RO3010 Introduction: The RO3010 circuit materials from Rogers are ceramic-filled PTFE composites that offer exceptional mechanical and electrical stability at a competitive price. These materials have a higher dielectric constant, making them ideal for broadband component design and a wide range of applications across various frequencies. RO3010 laminates are particularly suitable for circuit miniaturization.

Features: Rogers RO3010 ceramic-filled PTFE composites Dielectric constant of 10.2 +/- 0.30 at 10 GHz and 23°C Dissipation factor of 0.0022 at 10 GHz and 23°C Low Coefficient of Thermal Expansion: X-axis - 13 ppm/°C, Y-axis - 11 ppm/°C, Z-axis - 16 ppm/°C Td (temperature of decomposition) > 500°C Thermal conductivity of 0.95 W/mK Moisture absorption of 0.05% Operating temperature range: -40°C to +85°C

Benefits: Dimensional stability with an expansion coefficient matched to copper Economical laminate pricing for volume manufacturing Suitable for multi-layer board designs

PCB Stackup: 2-layer rigid PCB Copper_layer_1: 35 μm Rogers RO3010 Substrate: 10 mil (0.254 mm) Copper_layer_2: 35 μm

PCB Construction Details: Board dimensions: 80.1 mm x 56.74 mm (1 PCS) Minimum Trace/Space: 4/4 mils Minimum Hole Size: 0.3 mm No blind vias Finished board thickness: 0.37 mm Finished copper weight: 1 oz (1.4 mils) for outer layers Via plating thickness: 20 μm Surface finish: Immersion Gold Top Silkscreen: White Bottom Silkscreen: No Top Solder Mask: No Bottom Solder Mask: No 100% Electrical test conducted prior to shipment

PCB Statistics: Components: 24 Total Pads: 71 Thru-Hole Pads: 51 Top SMT Pads: 23 Bottom SMT Pads: 0 Vias: 67 Nets: 3

Artwork Type: Gerber RS-274-X Accepted Standard: IPC-Class-2 Availability: Worldwide

Some Typical Applications: Automotive radar applications Global positioning satellite antennas Cellular telecommunications systems: power amplifiers and antennas Patch antennas for wireless communications Direct broadcast satellites Datalink on cable systems Remote meter readers Power backplanes

Appendix: RO3010 Data Sheet

RO3010 Typical Value
Property	RO3010	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	10.2±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	11.2	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0022	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-395	Z	ppm/℃	10 GHz -50℃to 150℃	IPC-TM-650 2.5.5.5
Dimensional Stability	0.35 0.31	X Y	mm/m	COND A	IPC-TM-650 2.2.4
Volume Resistivity	105		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	105		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	1902 1934	X Y	MPa	23℃	ASTM D 638
Moisture Absorption	0.05		%	D48/50	IPC-TM-650 2.6.2.1
Specific Heat	0.8		j/g/k		Calculated
Thermal Conductivity	0.95		W/M/K	50℃	ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288℃)	13 11 16	X Y Z	ppm/℃	23℃/50% RH	IPC-TM-650 2.4.4.1
Td	500		℃?TGA		ASTM D 3850
Density	2.8		gm/cm3	23℃	ASTM D 792
Copper Peel Stength	9.4		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

BACK TO NOVEMBER