RO3006 PCB 25MIL | Bicheng PCB

WELCOME TO BICHENG

Rogers RO3006 High Frequency PCB Double Layer Board 25mil 0.635mm Thickness

Shipped:7th-Nov-2023

We are thrilled to announce the arrival of our latest offering: the RO3006 PCB. Designed with cutting-edge technology, this high-performance PCB is set to revolutionize your electrical and mechanical stability requirements.

RO3006 Introduction: The RO3006 laminates from Rogers are composite materials that combine PTFE with ceramic fillers, offering excellent electrical and mechanical stability. These advanced circuit materials maintain a stable dielectric constant (Dk) across a wide temperature range, avoiding the abrupt Dk change observed in PTFE glass materials near room temperature.

Features: Rogers RO3006 laminates with ceramic-filled PTFE composites Dielectric constant of 6.15 +/- 0.15 at 10 GHz and 23°C Dissipation factor of 0.002 at 10 GHz and 23°C Td (temperature of decomposition) > 500°C Thermal conductivity of 0.79 W/mK Moisture absorption of 0.02% Coefficient of thermal expansion (-55 to 288 °C): X-axis - 17 ppm/°C, Y-axis - 17 ppm/°C, Z-axis - 24 ppm/°C

Benefits: Consistent mechanical properties across various dielectric constants Suitable for multi-layer board designs with different dielectric constants Compatible with epoxy glass multi-layer board hybrid designs Low in-plane expansion coefficient (matching copper) Enables reliable surface-mounted assemblies Ideal for temperature-sensitive applications Excellent dimensional stability Volume manufacturing process Cost-effective laminate pricing

PCB Stackup: 2-layer rigid PCB Copper_layer_1: 35 μm Rogers RO3006 Substrate: 25 mil (0.635 mm) Copper_layer_2: 35 μm

PCB Construction Details: Board dimensions: 30 mm x 37 mm (1 PCS) Minimum Trace/Space: 5/5 mils Minimum Hole Size: 0.25 mm No blind vias Finished board thickness: 0.8 mm Finished copper weight: 1 oz (1.4 mils) for outer layers Via plating thickness: 20 μm Surface finish: Immersion Gold Top Silkscreen: White Bottom Silkscreen: No Top Solder Mask: No Bottom Solder Mask: No 100% Electrical test conducted prior to shipment

PCB Statistics: Components: 15 Total Pads: 50 Thru-Hole Pads: 31 Top SMT Pads: 19 Bottom SMT Pads: 0 Vias: 38 Nets: 2 Artwork Type: Gerber RS-274-X Accepted Standard: IPC-Class-2 Availability: Worldwide

Some Typical Applications: Automotive radar applications Global positioning satellite antennas Cellular telecommunications systems - power amplifiers and antennas Patch antennas for wireless communications Direct broadcast satellites Datalink on cable systems Remote meter readers Power backplanes

Appendix: RO3006 Data Sheet

RO3006 Typical Value
Property	RO3006	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	6.15±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	6.5	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.002	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-262	Z	ppm/℃	10 GHz -50℃to 150℃	IPC-TM-650 2.5.5.5
Dimensional Stability	0.27 0.15	X Y	mm/m	COND A	IPC-TM-650 2.2.4
Volume Resistivity	105		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	105		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	1498 1293	X Y	MPa	23℃	ASTM D 638
Moisture Absorption	0.02		%	D48/50	IPC-TM-650 2.6.2.1
Specific Heat	0.86		j/g/k		Calculated
Thermal Conductivity	0.79		W/M/K	50℃	ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288℃)	17 17 24	X Y Z	ppm/℃	23℃/50% RH	IPC-TM-650 2.4.4.1
Td	500		℃?TGA		ASTM D 3850
Density	2.6		gm/cm3	23℃	ASTM D 792
Copper Peel Stength	7.1		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

BACK TO NOVEMBER