RO3003 PCB 30mil | Bicheng PCB

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RO3003 High Frequency PCB Built on 30mil 0.762mm Substrates

Shipped: 21st-Oct-2023

We are pleased to introduce our RO3003 High Frequency PCB, built on 30mil (0.762mm) substrates. This advanced PCB is specifically designed to meet the demanding requirements of high-frequency applications, offering exceptional signal integrity and performance.

Rogers RO3003

Rogers RO3003 ceramic-filled PTFE composites offer exceptional properties that make them an excellent choice for various applications. With a dielectric constant of 3.0+/- .04 at 10 GHz/23°C and a dissipation factor of 0.001 at the same frequency and temperature, these PCB substrates provide consistent and reliable electrical performance. The high thermal stability, with a Td> 500°C, ensures their suitability for demanding environments.

One of the notable advantages of RO3003 PCB substrates is their low dielectric loss, enabling their usage in applications up to 77 GHz. Additionally, these substrates exhibit uniform mechanical properties across a range of dielectric constants, making them ideal for multi-layer board designs. They also work well in conjunction with epoxy glass multi-layer board hybrid designs, offering versatility in complex PCB layouts.

The stability of the dielectric constant versus temperature and frequency is another valuable characteristic of RO3003 substrates. This stability makes them particularly well-suited for applications such as band pass filters, microstrip patch antennas, and voltage-controlled oscillators. Furthermore, their low in-plane expansion coefficient, which matches that of copper, ensures more reliable surface-mounted assemblies and excellent dimensional stability. This feature is especially beneficial for applications sensitive to temperature changes.

PCB Stackup

In terms of construction, the stackup of this RO3003 PCB typically involves a 2-layer rigid PCB design. This includes copper layers on both sides of the RO3003 substrate, each with a thickness of 35 μm. The RO3003 substrate itself has a thickness of 30 mil (0.762 mm). This construction provides a compact and efficient PCB layout while maintaining the desired electrical

PCB Construction Details

When it comes to construction details, the board dimensions of RO3003 PCBs are 45mm x 54.3 mm, ensuring a compact form factor. The minimum trace/space is set at 5/6 mils, allowing for precise routing and tight integration of components. The minimum hole size is 0.3mm, accommodating various component and interconnect requirements. The finished board thickness is 0.88mm, providing a balance between space constraints and mechanical robustness.

RO3003 PCBs undergo rigorous testing to ensure their quality and reliability. A 100% electrical test is performed prior to shipment, guaranteeing that each PCB meets the required specifications. The PCB statistics reveal that these substrates can accommodate 27 components and have a total of 61 pads, including 35 through-hole pads and 26 SMT pads. With 41 vias and 3 nets, RO3003 PCBs offer the necessary connectivity for complex circuitry.

Artwork and Standards

To ensure compatibility and adherence to industry standards, RO3003 PCBs are supplied in Gerber RS-274-X format and meet the IPC-Class-2 standard. This ensures seamless integration into existing manufacturing processes and facilitates reliable and efficient production.

The availability of RO3003 PCBs is not limited to a specific region, as they are readily accessible worldwide. This global availability ensures that engineers and manufacturers can easily incorporate these PCBs into their projects, regardless of their location.

Typical Applications

RO3003 PCBs find application in various industries due to their excellent stability of dielectric constant over different temperatures and frequencies. For instance, they are well-suited for automotive radar applications, including advanced driver assistance systems (ADAS) operating at 77 GHz. These substrates also excel in global positioning satellite antennas, cellular telecommunications systems (power amplifiers and antennas), wireless communications (patch antennas), direct broadcast satellites, datalink on cable systems, remote meter readers, and power backplanes.

Parameter	Value
PCB Substrates	Rogers RO3003 ceramic-filled PTFE composites
	Dielectric constant of 3.0+/- .04 at 10 GHz/23°C
	Dissipation factor of 0.001 at 10 GHz/23°C
	Td> 500°C
	Thermal Conductivity of 0.5 W/mK
	Moisture Absorption of 0.04%
	Coefficient of Thermal Expansion (-55 to 288 °C): X axis 17 ppm/°C, Y axis 16 ppm/°C, Z axis 25 ppm/°C
Features & Benefits	Low dielectric loss, suitable for applications up to 77 GHz
	Uniform mechanical properties for a range of dielectric constants
	Ideal for multi-layer board designs
	Suitable for use with epoxy glass multi-layer board hybrid designs
	Stable dielectric constant versus temperature and frequency
	Low in-plane expansion coefficient
	Volume manufacturing process, economical laminate pricing
Stackup: 2-layer rigid PCB	Copper_layer_1 - 35 μm
	Rogers RO3003 Substrate - 30mil (0.762mm)
	Copper_layer_2 - 35 μm
Construction Details	Board dimensions: 45mm x 54.3 mm=1PCS
	Minimum Trace/Space: 5/6 mils
	Minimum Hole Size: 0.3mm
	No Blind vias
	Finished board thickness: 0.88mm
	Finished Cu weight: 1 oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: Immersion Gold
	Top Silkscreen: White
	Bottom Silkscreen: No
	Top Solder Mask: Green
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 27
	Total Pads: 61
	Thru Hole Pads: 35
	Top SMT Pads: 26
	Bottom SMT Pads: 0
	Vias: 41
	Nets: 3
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide
Some Typical Applications	Automotive radar applications
	Global positioning satellite antennas
	Cellular telecommunications systems - power amplifiers and antennas
	Patch antenna for wireless communications
	Direct broadcast satellites
	Datalink on cable systems
	Remote meter readers
	Power backplanes

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