RO3003 PCB 20mil | Bicheng PCB

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RO3003 PCB 2-layer 20mil 0.508mm RF High Frequency Circuit Board

Shipped: 5th-Dec-2023

1. RO3003 Introduction Rogers RO3003 high frequency laminates are ceramic-filled PTFE composites for use in commercial microwave and RF applications. RO3003 laminates offer excellent stability of dielectric constant (Dk) over various temperatures and frequencies. This stability also includes the elimination of the step change in Dk that typically occurs near room temperature with PTFE glass materials. This is ideal for applications including automotive radar (77 GHz), advanced driver assistance systems (ADAS) and 5G wireless infrastructure (mmWave).

2. Features - Rogers RO3003 ceramic-filled PTFE composites - Dielectric constant of 3+/- 0.04 at 10 GHz/23°C - Dissipation factor of 0.001 at 10 GHz/23°C - Td> 500°C - Thermal Conductivity of 0.5 W/mK - Moisture Absorption of 0.04% - Coefficient of Thermal Expansion (-55 to 288 °C)：X axis 17 ppm/°C, Y axis 16 ppm/°C, Z axis 25 ppm/°C

3. Benefits - Low dielectric loss can be used in applications up to 77 GHz.

-Excellent mechanical properties versus temperature Reliable stripline and multi-layer board constructions.

- Uniform mechanical properties for a range of dielectric constants Ideal for multi-layer board designs with a range of dielectric constants ? Suitable for use with epoxy glass multi-layer board hybrid designs

- Stable dielectric constant versus temperature and frequency Ideal for band pass filters, microstrip patch antennas, and voltage controlled oscillators.

- Low in-plane expansion coefficient (match to copper) Allows for more reliable surface mounted assemblies Ideal for applications sensitive to temperature change Excellent dimensional stability

-Volume manufacturing process Economical laminate pricing

4. PCB Stackup: 2-layer rigid PCB Copper_layer_1 - 35 μm Rogers RO3003 Substrate - 20mil (0.508mm) Copper_layer_2 - 35 μm

5. PCB Construction details: - Board dimensions: 85.7mm x 73.2 mm=1PCS - Minimum Trace/Space: 4/4 mils - Minimum Hole Size: 0.35mm - No Blind vias. - Finished board thickness: 0.6mm - Finished Cu weight: 1 oz (1.4 mils) outer layers - Via plating thickness: 20 μm - Surface finish: Immersion Gold - Top Silkscreen: No - Bottom Silkscreen: No - Top Solder Mask: No - Bottom Solder Mask: No - 100% Electrical test used prior to shipment

6. PCB Statistics: Components: 27 Total Pads: 61 Thru Hole Pads: 40 Top SMT Pads: 21 Bottom SMT Pads: 0 Vias: 42 Nets: 4

7. Type of artwork supplied: Gerber RS-274-X

8. Accepted standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications - Automotive radar applications - Global positioning satellite antennas - Cellular telecommunications systems - power amplifiers and antennas - Patch antenna for wireless communications - Direct broadcast satellites - Datalink on cable systems - Remote meter readers - Power backplanes

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