Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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RF-35 High Frequency PCB
 

Introduction
Hello everyone,
Welcome back to our channel. My name is Jane, the regional sales manager for Bicheng PCB. Today, we’re going to talk about a type of organic-ceramic laminate from Taconic's ORCER family --- RF-35.

RF-35 laminates are PTFE-based with woven glass reinforcement. It is the consequence of Taconic's proficiency in coated PTFE fiberglass and ceramic fill technologies.

Let’s have a look at the properties of RF-35 substrate.

RF-35 Typical Properties
RF-35 has a dielectric constant of 3.50 at 1.9 GHz, with a dissipation factor of 0.0018 at the same frequency.

Its moisture absorption is only 0.02% at .060 inch,

and it has a peel strength greater than 8.0 lbs./linear inch for 1/2 oz. copper and greater than 10.0 lbs./linear inch for 1 oz. copper, as measured by IPC-TM 650 2.4.8.

The material also has a dielectric breakdown of 41 kV, volume resistivity of 1.26 x 10^9 Mohm/cm,

and surface resistivity of 1.46 x 10^8 Mohm, as measured by IPC-TM 650 2.5.6 and IPC-TM 650 2.5.17.1, respectively.

RF-35 has an arc resistance of greater than 180 seconds, as measured by IPC TM 650 2.5.1.

Its flexural strength lengthwise and crosswise are greater than 22,000 psi and greater than 18,000 psi, respectively, as measured by ASTM D 790.

The tensile strength lengthwise and crosswise are measured at 27,000 psi (or 187 N/mm^2) and 21,000 psi (or 145 N/mm^2), respectively, as measured by ASTM D 638.

RF-35 has a dimensional stability of 0.00004 in/in lengthwise and a dimensional stability of -0.00010 in/in crosswise, as measured by IPC-TM 650 2.4.39.

RF-35 is high Tg materials, with value of greater than 315°C.

The material has a thermal conductivity of 0.24 W/m/K, as measured by ASTM F 433.

Its X-Y CTE is measured between 19-24 ppm/°C, while its Z CTE is measured at 64 ppm/°C, as measured by ASTM D 3386 (TMA).

The material is also rated V-0 for flammability, as measured by UL-94, and has a hardness of 34% on the Rockwell M scale.

 
 

Property

Test Method

Unit

Value

Unit

Value

Dielectric Constant @ 1.9 GHz

IPC-TM 650 2.5.5

3.5

3.5

Dissipation Factor @ 1.9 GHz

IPC-TM 650 2.5.5

0.0018

0.0018

Moisture Absorption (.060")

IPC-TM 650 2.6.2.1

%

0.02

%

0.02

Peel Strength (1/2 oz. copper)

IPC-TM 650 2.4.8

lbs./linear inch

>8.0

N/mm

>1.5

Peel Strength (1 oz. copper)

IPC-TM 650 2.4.8

lbs./linear inch

>10.0

N/mm

>1.8

Dielectric Breakdown

IPC-TM 650 2.5.6

kV

41

kV

41

Volume Resistivity

IPC-TM 650 2.5.17.1

Mohm/cm

1.26 x 109

Mohm/cm

1.26 x 109

Surface Resistivity

IPC-TM 650 2.5.17.1

Mohm

1.46 x 108

Mohm

1.46 x 108

Arc Resistance

IPC TM 650 2.5.1

seconds

>180

seconds

>180

Flexural Strength Lengthwise

ASTM D 790

psi

>22,000

N/mm2

>152

Flexural Strength Crosswise

ASTM D 790

psi

>18,000

N/mm2

>124

Tensile Strength Lengthwise

ASTM D 638

psi

27,000

N/mm2

187

Tensile Strength Crosswise

ASTM D 638

psi

21,000

N/mm2

145

Dimensional Stability Lengthwise

IPC-TM 650 2.4.39

in/in

0.00004

mm/mm

0.00004

Dimensional Stability Crosswise

IPC-TM 650 2.4.39

in/in

-0.0001

mm/mm

-0.0001

Tg

TMA

°C

>315

°F

>600

Thermal Conductivity

ASTM F 433

W/m/K

0.24

W/m/K

0.24

X-Y CTE

ASTM D 3386 (TMA)

ppm/°C

19-24

ppm/°C

19-24

Z CTE

ASTM D 3386 (TMA)

ppm/°C

64

ppm/°C

64

Flammability

UL-94

V-0

V-0

Hardness

Rockwell M Scale

34

34

 

PCB Capability (RF-35)
Let’s see our PCB capability on RF-35 material.

We can provide you with single layer, double layer, multi-layer and hybrid types, with standard dielectric thicknesses of 10 mils, 20 mils, 30 mils, and 60 mils.

The finished copper thickness options are 1oz and 2oz.

We can offer PCBs up to a maximum size of 400 mm by 500 mm. This can be a single board in the panel or a panel with multiple alternative designs.

Solder mask of green, black, blue and yellow etc is available in house.

Various options for plating pads are provided, including immersion gold, HASL, immersion silver, immersion tin, OSP, pure gold, and bare copper etc.

Various options for plating pads are provided, including immersion gold, HASL, immersion silver, immersion tin, OSP, pure gold, and bare copper etc.

 
 

PCB material:

PTFE Ceramic Fiberglass

Designation:

RF-35

Dielectric constant:

3.5

Dissipation factor

0.0018

Layer count:

Single layer, Double layer, Multilayer, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

Laminate thickness:

10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Red, Yellow etc.

Surface finish:

Immersion gold, HASL, Immersion silver, Immersion tin, OSP, Pure gold, Bare copper, ENEPIG etc..

 

A Piece of RF-35 PCB
On the screen is a type of 60mil RF-35 PCB with immersion gold for power amplifiers. We can also find its applications in passive components, filters and couplers etc.

 
 
 

Conclusion
Due to the softness of the PTFE resin system, machining of PTFE-based substrates is often more challenging than machining of epoxy-based substrates. The type of fiberglass utilized in the substrate has an impact on the quality of routing with respect to burrs and fibers. The heavier the fiberglass weave, the more difficult it is to cut.

RF-35 product employs a heavy weight 7628 glass style, which offers good dimensional stability and rigidity but is typically more challenging to drill or rout compared to the product which uses a medium weight glass style.

OK. This concludes the episode. Thank you for your reading. See you next time.

 
 
 

 

 

 
 

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