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Taconic RF-35TC High Frequency PCB 2-layer Board 20mil 0.508mm Thickness

Shipped: 22nd-Nov-2023  

We are excited to showcase one of our latest shipments of RF-35TC high-frequency PCBs, which boast outstanding thermal conductivity.

RF-35TC Introduction: RF-35TC is a high-performance substrate that offers exceptional characteristics, including a low dissipation factor and high thermal conductivity. It is particularly suitable for high-power applications where even a slight improvement of 1/10th of a dB is crucial. RF-35TC is a PTFE-based substrate with ceramic fillers and fiberglass reinforcement. Unlike its synthetic rubber (hydrocarbon) counterparts, RF-35TC does not oxidize, yellow, or exhibit an upward drift in dielectric constant and dissipation factor.
Features: Thermally conductive low-loss laminate Dielectric Constant (DK) of 3.5 +/- 0.05 at 10 GHz and 23°C Dissipation Factor of 0.002 at 10 GHz and 23°C Thermal Conductivity of 0.87 W/m/K for 0.5 oz copper-clad and 0.92 W/m/K for 1 oz copper-clad Coefficient of Thermal Expansion (CTE): X-axis - 11 ppm/°C, Y-axis - 13 ppm/°C, Z-axis - 34 ppm/°C Td (temperature at 5% weight loss): 436°C Low Moisture Absorption of 0.05%
Benefits: Best-in-class low-loss tangent Exceptional thermal management capabilities Stable DK across a wide temperature range Improved antenna gains and efficiencies Excellent adhesion to very low-profile copper
PCB Stackup: 2-layer rigid PCB Copper_layer_1: 35 μm RF-35TC Core: 0.508 mm (20 mil) Copper_layer_2: 35 μm
PCB Construction Details: Board dimensions: 65.25 mm x 83 mm (1 PCS), with a tolerance of +/- 0.15 mm Minimum Trace/Space: 4/4 mils Minimum Hole Size: 0.25 mm No blind vias Finished board thickness: 0.6 mm Finished copper weight: 1 oz (1.4 mils) for outer layers Via plating thickness: 20 μm Surface finish: Immersion gold Top Silkscreen: White Bottom Silkscreen: No Top Solder Mask: Green Bottom Solder Mask: No 100% Electrical test conducted prior to shipment
PCB Statistics: Components: 28 Total Pads: 91 Thru-Hole Pads: 62 Top SMT Pads: 29 Bottom SMT Pads: 0 Vias: 62 Nets: 3
Artwork Type: Gerber RS-274-X Accepted Standard: IPC-Class-2 Availability: Worldwide
Typical Applications: Filters, couplers, and power amplifiers Antennas Satellites
Appendix: RF-35TC Data Sheet
 
 

RF-35TC TYPICAL VALUES

Property

Test Method

Unit

Value

Unit

Value

DK at 10 GHz

IPC-650 2.5.5.5.1(modified)

3.5

3.5

Tck(-30 to 120℃）

IPC-650 2.5.5.5.1(modified)

ppm

24

ppm

24

Df at 10 GHz

IPC-650 2.5.5.5.1(modified)

0.0011

0.0011

Dielectric Breakdown

IPC-650 2.5.6(in-Plane,Two Pins in Oil)

kV

56.7

kV

56.7

Dielectric Strength

ASTM D 149(Through Plane)

V/mil

570

V/mm

22,441

Arc Resistance

IPC-650 2.5.1

Seconds

304

Seconds

304

Moisture Absorption

IPC-650 2.6.2.1

%

0.05

%

0.05

Flexural Strength(MD)

ASTM D 790/IPC-650 2.4.4

psi

12,900

N/mm2

88.94

Flexural Strength(CD)

ASTM D 790/IPC-650 2.4.4

psi

11,700

N/mm2

80.67

Tensile Strength(MD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

9,020

N/mm2

62.19

Tensile Strength(CD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

7,740

N/mm2

53.37

Elongation at Break(MD)

ASTM D 3039/IPC-TM-650 2.4.19

%

1.89

N/mm

1.89

Elongation at Break(CD)

ASTM D 3039/IPC-TM-650 2.4.19

%

1.7

%

1.7

Young's Modulus(MD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

667,000

N/mm2

4,599

Young's Modulus(CD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

637,000

N/mm2

4,392

Poisson's Ratio(MD)

ASTM D 3039/IPC-TM-650 2.4.19

0.18

0.18

Poisson's Ratio(CD)

ASTM D 3039/IPC-TM-650 2.4.19

0.23

0.18

Compressive Modulus

ASTM D 695(23℃)

psi

560,000

N/mm2

3,861

Flexural Strength(MD)

ASTM D 790/IPC-650 2.4.4

psi

1.46 x 106

N/mm2

10,309

Flexural Strength(CD)

ASTM D 790/IPC-650 2.4.4

psi

1.50 x 106

N/mm2

10,076

Peel Stength(½ oz.CVH)

IPC-650 2.4.8(Thermal Stress.)

Ibs./inch

7

g/cm3

1.25
 

Thermal Conductivity(Unclad,125℃)

ASTM F433(Guarded Heat Flow)

W/(mK)

0.6

W/(mK)

0.6

Thermal Conductivity(C1/C1,125℃)

ASTM F433(Guarded Heat Flow)

W/(mK)

0.92

W/(mK)

0.92

Thermal Conductivity(CH/CH,125℃)

ASTM F433(Guarded Heat Flow)

W/(mK)

0.87

W/(mK)

0.87

Dimensional Stability(MD)

IPC-650-2.4.39 Sec.5.4(After Etch)

mils/in.

0.23

mm/M

0.23

Dimensional Stability(CD)

IPC-650-2.4.39 Sec.5.4(After Etch)

mils/in.

0.64

mm/M

0.64

Dimensional Stability(MD)

IPC-650-2.4.39 Sec.5.5(Thermal Stress.)

mils/in.

-0.04

mm/M

-0.04

Dimensional Stability(CD)

IPC-650-2.4.39 Sec.5.5(Thermal Stress.)

mils/in.

0.46

mm/M

0.46

Surface Resistivity

IPC-650 2.5.17.1(after elevated temp.)

Mohms

8.33 x 107

Mohms

8.33 x 107

Surface Resistivity

IPC-650 2.5.17.1(after humidity)

Mohms

6.42 x 107

Mohms

6.42 x 107

Volume Resistivity

IPC-650 2.5.17.1(after elevated temp.)

Mohms/cm

5.19 x 108

Mohms/cm

5.19 x 108

Volume Resistivity

IPC-650 2.5.17.1(after humidity)

Mohms/cm

2.91 x 108

Mohms/cm

2.91 x 108

CTE(X axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

11

ppm/℃

11

CTE(Y axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

13

ppm/℃

13

CTE(Z axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

34

ppm/℃

34

Density

ASTM D 792

g/cm3

2.35

g/cm3

2.35

Hardness

ASTM D 2240(Shore D)

79.1

79.1

Strain at Break(MD)

ASTM D 790/IPC-650 2.4.4

%

0.014

%

0.014

Strain at Break(CD)

ASTM D 790/IPC-650 2.4.4

%

0.013

%

0.013

Specific Heat

ASTM E 1269-05,E 967-08,E968-02

j/(g℃)

0.94

j/(g℃)

0.94

Td(2% Weight Loss)

IPC-650 2.4.24.6/TGA

oF

788

℃

420

Td(5% Weight Loss)

IPC-650 2.4.24.6/TGA

oF

817

℃

436
 
 
 
 
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