RF-30A PCB 20MIL | Bicheng PCB

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Taconic RF-30A High Frequency PCB Dual Layer Board 20mil 0.508mm Thick

Shipped: 8th-Nov-2023

We’re delighted to introduce a type of our latest delivery of RF-30A high frequency PCB, an organic-ceramic laminate that incorporates woven glass reinforcement.

RF-30A Introduction: RF-30A, a member of Taconic's RF substrate family, is an organic-ceramic laminate that incorporates woven glass reinforcement. It combines Taconic's expertise in ceramic filler and PTFE coating technology. RF-30A is an optimal choice for high-volume, cost-effective applications in commercial microwave and radio frequency fields.

RF-30A exhibits exceptionally stable electrical and mechanical properties, surpassing the requirements of most designers. This low-loss dielectric substrate, coupled with low-profile copper foil, ensures stable electrical performance with improved levels of Passive Intermodulation Distortion (PIMD) and reduced insertion loss across a wide frequency range. Its mechanical properties, including lower Coefficient of Thermal Expansion (CTE), enhanced dimensional stability, and increased rigidity, minimize the impact of external factors on RF components.

RF-30A's outstanding peel strength for 1/2 ounce and 1 ounce RT copper is crucial for scenarios involving rework or repeated reflow processes. Its ultra-low moisture absorption rate, combined with a stable loss tangent, minimizes phase shift under varying temperature and humidity conditions. Additionally, its dimensional stability contributes to stable phase and impedance properties across a broad frequency range.

RF-30A has been optimized with ceramic additives to achieve a low Z-axis CTE, improving Plated Through-Hole (PTH) reliability and facilitating the fabrication of multilayer circuits. These properties also enhance PIMD performance stability.

Features: Dielectric Constant (DK) of 2.97 +/- 0.05 at 1.9 GHz and 23°C Dissipation Factor of 0.0013 at 1.9 GHz and 23°C Thermal Conductivity of 0.42 W/m/K Coefficient of Thermal Expansion (CTE): X-axis - 8 ppm/°C, Y-axis - 11 ppm/°C, Z-axis - 60 ppm/°C Density (specific gravity) of 2.16 g/cm3

Benefits: Excellent PIM values in PCBs (measured below -160 dBc) Improved quality of Plated Through-Holes (PTH) Stable mechanical properties Stable performance at high frequencies Stable performance at high temperatures Low moisture absorption Excellent peel strength Excellent price-to-performance ratio

PCB Stackup: 2-layer rigid PCB Copper_layer_1: 35 μm RF-30A Core: 0.508 mm (20 mil) Copper_layer_2: 35 μm

PCB Construction Details: Board dimensions: 102.02 mm x 65.54 mm (1 PCS), with a tolerance of +/- 0.15 mm Minimum Trace/Space: 4/5 mils Minimum Hole Size: 0.35 mm No blind vias Finished board thickness: 0.6 mm Finished copper weight: 1 oz (1.4 mils) for outer layers Via plating thickness: 20 μm Surface finish: Bare copper Top Silkscreen: No Bottom Silkscreen: No Top Solder Mask: No Bottom Solder Mask: No 100% Electrical test conducted prior to shipment

PCB Statistics: Components: 37 Total Pads: 102 Thru-Hole Pads: 71 Top SMT Pads: 31 Bottom SMT Pads: 0 Vias: 59 Nets: 4

Artwork Type: Gerber RS-274-X Accepted Standard: IPC-Class-2 Availability: Worldwide

Typical Applications: Antennas and subcomponents RF passive components Power amplifiers

Appendix: RF-30A Data sheet

RF-30A Typical Values
Property	Test Method	Unit	Value	Unit	Value
Dk @ 1.9 GHz	IPC-650 2.5.5.5.1 (Modified)		2.97 ± 0.05		2.97 ± 0.05
Df @ 1.9 GHz	IPC-650 2.5.5.5.1 (Modified)		0.0013		0.0013
Df @ 10 GHz	IPC-650 2.5.5.5.1 (Modified)		0.0020		0.0020
PIMD	Internal (60 mil @1800 MHz)	dBc	-164	dBm	-121
Moisture Absorption	IPC-650 2.6.2.1	%	0.05	%	0.05
Peel Strength (1 oz. copper)	IPC-650 2.4.8	lbs/in	12	N/mm	2.1
Volume Resistivity	IPC-650 2.5.17.1	Mohm/cm	3.0 x 109	Mohm/cm	3.0 x 109
Surface Resistivity	IPC-650 2.5.17.1	Mohm	2.0 x 108	Mohm	2.0 x 108
Flexural Strength (MD)	IPC-650 2.4.4	psi	18,000	N/mm2	126.5
Flexural Strength (CD)	IPC-650 2.4.4	psi	17,000	N/mm2	119.5
Tensile Strength (MD)	PC-650 2.4.18.3	psi	19,000	N/mm2	133.6
Tensile Strength (CD)	IPC-650 2.4.19	psi	15,000	N/mm2	105.5
Dimensional Stability (MD)	IPC-650 2.4.39 (After Etch)	% (30 mil)	0.049	% (60 mil)	0.025
Dimensional Stability (CD)	IPC-650 2.4.39 (After Etch)	% (30 mil)	0.041	% (60 mil)	0.026
Dimensional Stability (MD)	IPC-650 2.4.39 (After Stress)	% (30 mil)	0.049	% (60 mil)	0.019
Dimensional Stability (CD)	IPC-650 2.4.39 (After Stress)	% (30 mil)	0.031	% (60 mil)	0.011
Density (Specific Gravity)	IPC-650 2.3.50	g/cm3	2.16	g/cm3	2.16
Specific Heat	IPC-650 2.4.50	J/gK	0.95	J/gK	0.95
Thermal Conductivity	IPC-650 2.4.50	W/M*K	0.42	W/M*K	0.42
CTE (X axis) (50°C - 150°C)	IPC-650 2.4.41	ppm/°C	8	ppm/°C	8
CTE (Y axis) (50°C - 150°C)	IPC-650 2.4.41	ppm/°C	11	ppm/°C	11
CTE (Z axis) (50°C - 150°C)	IPC-650 2.4.41	ppm/°C	60	ppm/°C	60
Flammability Rating	Internal		V-0		V-0

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