Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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Metal Based High Frequency PCB

Metal based substrate is a combination of metal based high frequency materials. The intermediate medium is made of high frequency materials ( such as PTFE and others), one side is coated with copper foil, the other side is coated with copper base or aluminum base. The PCB made on this kind of modified material, we can call it metal based high frequency PCB.

Parameters
DK @ 10GHz & Tolerance: 2.20+/- 0.03
Thermal Change of DK (ppm/℃） : -48
Loss Tangent, Df@10GHz: 0.001
Thermal Conductivity(W/mk): 0.35
Td （℃）: 476
Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98
Density (g/cm3): 1.80
Volume Resisivity (Mohm.cm) 1x 10^8
Surface Resistivity (Mohm): 1 x 10^8
Moisture Absorption: 0.02
Peel Strength (N/cm) (1oz): 20
Flammability Rating: UL94 V0
 
Our PCB Capability (F4BTMS220)

PCB Material:

Modified PTFE Copper Clad with Ceramic Filler

Designator:

F4BTMS220

Dielectric constant @ 10GHz:

2.2

Layer count:

Single Layer

Copper weight:

0.5oz, 1oz

PCB thickness:

1.2mm - 9.0mm

0.047” - 0.354”

Solder mask:

Green, Red, Black, White, Blue etc.

PCB size:

≤400mm X 500mm

Surface finish:

Bare copper, HASL, ENIG, Immersion tin etc.

 
 


Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler
Designator of Substrate Material Composition / Dielectric Layer Types DK @ 10GHz & Tolerance Thermal Change of Dk(ppm/℃) Loss Tangent, Df@10GHz Thermal Conductivity (W/mk) Td (℃) Coefficient of Thermal Expansion -50℃ -260 ℃ (ppm/℃) Density (g/cm3): Volume Resisivity (Mohm.cm) Surface Resistivity (Mohm) Moisture Absorption (%) Peel Strength (N/cm) (1oz) Flammability Rating
X Y Z
F4BTMS PTFE/Ceramic/ Superfine woven glass F4BTMS220 2.20±0.03 -48 0.0010 0.35 476 40 45 98 1.80 1X108 1X108 0.02 20 V-0
F4BTMS294 2.94±0.04 -20 0.0012 0.58 490 10 12 22 2.25 1X108 1X108 0.03 12 V-0
F4BTMS300 3.00±0.04 -20 0.0013 0.58 490 10 11 22 2.28 1X108 1X108 0.04 12 V-0

 
Type of Metal Base: Aluminum, Copper
Thickness of Metal Base: 1.0mm, 2.0mm, 3.0mm, 4.0mm
Base copper: 0.5oz, 1oz

 
Thickness and size F4BTMS
Designator of Substrate Standard Dielectric Thickness(Without the cladding) and Tolerance Available Copper Foil Standard Size
F4BTMS

0.127mm(5mil) ±0.0127mm(0.5mil)

0.254mm(10mil) ±0.02mm(1mil)

0.508mm(20mil) ±0.03mm(1.19mil)

0.762mm(30mil) ±0.04mm(1.58mil)

1.016mm(40mil) ±0.05mm(2mil)

1.524mm(60mil) ±0.05mm(2mil)

3.05mm(120mil) ±0.1mm(4mil)

5.08mm(200mil) ±0.127mm(5mil)

 Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us. 0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50 Resistance Copper

305mm x 460mm (12" x 18")

460mm x 610mm (18" x 24")

500mm x 600mm (19.7" x 23.6")

915mm x 1220mm (36" x 48")
 
 

 
 
 
 
 
 
 
 
 
 

 

 

 
　

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