Low Profile RO4003C LoPro PCB Supplier

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Low Profile RO4003C High Frequency PCB

RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.

Features and Benefits:
RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density

Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility

Lead-free process compatible
1. High temperature processing
2. Meets environmental concerns

CAF resistant

Some Typical Applications:

Digital applications such as servers, routers, and high speed back planes
Cellular base station antennas and power amplifiers
LNB’s for direct broadcast satellites
RF Identification Tags

Our PCB Capability (RO4003C LoPro)

PCB Material:	Hydrocarbon Ceramic Laminates
Designation:	RO4003C LoPro
Dielectric constant:	3.38±0.05
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 μm), 1oz (35μm), 2oz (70μm)
Laminate thickness:	12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver etc..

Typical Properties of RO4003C LoPro

Property	Typical Value	Direction	Units	Condition	Test Method
Dielectric Constant, Process	3.38 ± 0.05	Z	--	10 GHz/23°C	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design	3.5	Z	--	8 to 40 GHz	Differential Phase Length Method
Dissipation Factor tan, d	0.0027 0.0021	Z	--	10 GHz/23°C 2.5 GHz/23°C	IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of er	40	Z	ppm/°C	-50°C to 150°C	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 X 10^10		MΩ-cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 X 10^9		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	KV/mm(V/mil)	0.51mm(0.020”)	IPC-TM-650 2.5.6.2
Tensile Modulus	26889(3900)	Y	MPa(kpsi)	RT	ASTM D638
Tensile Strength	141(20.4)	Y	MPa(kpsi)	RT	ASTM D638
Flexural Strength	276(40)		MPa(kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X,Y	mm/m(mils/inch)	after etch +E2/150°C	IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion	11	X	ppm/°C	-55 to 288°C	IPC-TM-650 2.1.41
	14	Y
	46	Z
Tg	>280		°C TMA	A	IPC-TM-650 2.4.24.3
Td	425		°C TGA		ASTM D3850
Thermal Conductivity	0.64		W/m/°K	80°C	ASTM C518
Moisture Absorption	0.06		%	48 hrs immersion 0.060” sample Temperature 50°C	ASTM D570
Density	1.79		gm/cm3	23°C	ASTM D792
Copper Peel Strength	1.05(6.0)		N/mm(pli)	after solder float 1 oz. TC Foil	IPC-TM-650 2.4.8
Flammability	N/A				UL 94
Lead-Free Process Compatible	Yes

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