Kappa 438 PCB Supplier

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Kappa 438 High Frequency PCB

Introduction

Hello and welcome back to our channel. My name is Ivy, the sales manager at Bicheng PCB, and it's wonderful to see you here again.

In today's discussion, we will explore Rogers Kappa 438 PCBs, a superior choice for wireless circuit designers as an alternative to FR-4 materials. These PCBs offer enhanced performance, consistency, and reliability, all while being cost-effective and user-friendly.

The Kappa 438 laminates are designed with a hydrocarbon ceramic system reinforced with glass. This low-loss material can be manufactured using standard epoxy/glass (FR-4) processes, simplifying circuit fabrication tasks.

Kappa 438 laminates are rated UL 94 V-0 for flame retardancy and are compatible with lead-free solder processes.

Now let’s start from the data sheet.

Kappa 438 Typical Properties

The dielectric constant of the material is 4.38 at 2.5 GHz, with a dissipation factor of 0.005 at 10 GHz and 23°C.

The thermal coefficient of dielectric constant is -21 ppm/°C at 10 GHz over a temperature range of -50°C to 150°C.

Kappa 438 has a volume resistivity of 2.9 x 10^9 M??cm and a surface resistivity of 6.2 x 10^7 M?.

Its electrical strength is 675 V/mil.

In terms of mechanical properties, the material has a tensile strength of 16 kpsi and 12 kpsi in the MD and CMD directions, respectively, as well as a flexural strength of 25 kpsi and 19 kpsi in the MD and CMD directions, respectively.

Coefficient of thermal expansion indicates how much a material will expand or contract with changes in temperature. Kappa 438 has a CTE of 13 ppm/°C in X axis over a temperature range of -55 to 288°C, measured using the IPC-TM-650 2.4.41 test method. It also has a CTE of 16 ppm/°C in Y direction and 42 ppm/°C in Z direction.

Kappa 438 PCB has a thermal conductivity of 0.64 W/(m.K) at 80°C, indicating it is capable of efficiently conducting heat away from the electronic components, ensuring that the device operates efficiently and doesn't overheat.

Time to delamination is over 60 minutes at 288°C, indicating that Kappa 438 can withstand high temperatures for a long period without any delamination.

Its Tg is greater than 280°C, indicating that Kappa 438 can withstand high temperatures without losing its mechanical properties or becoming brittle, and its Td is 414°C.

Kappa 438 has a moisture absorption rate of 0.07%, we have confidence the material is resistant to water and will not be affected by the presence of moisture in the device's environment.

A high Young's modulus value of 2264 kpsi and a high flex modulus value of 2337 kpsi indicate that Kappa 438 is strong and can withstand mechanical stress without deforming or breaking.

A low bow value of 0.03% and a low twist value of 0.08% also indicate the material has good dimensional stability and will not deform or warp during the manufacturing process or in use.

The copper peel strength value of 5.8 lbs/in for 1 oz (35 μm) foil indicates that Kappa 438 has good adhesion properties and can withstand thermal stress without delaminating.

It has a flammability rating of V-0 according to UL 94, indicating that the material is self-extinguishing and will not propagate a flame in case of a fire

A specific gravity value of 1.99 g/cm3 indicates Kappa 438 is relatively dense and can provide good mechanical support to electronic components.

Finally, Kappa 438 is lead-free process compatible.

Property	Typical Value Kappa 438	Direction	Units	Condition	Test Method
Dielectric Constant, er Design	4.38	Z	-	2.5 GHz	Differential Phase Length Method
Dissipation Factor tan, d	0.005	Z	-	10 GHz/23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant e	-21	-	ppm/°C	10 GHz (-50 to 150°C)	Modified IPC-TM-650 2.5.5.5
Volume Resistivity	2.9 x 10^9	-	MΩ•cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	6.2 x 10^7	-	MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	675	Z	V/mil	-	IPC-TM-650 2.5.6.2
Tensile Strength	16, 12	MD CMD	kpsi	-	ASTM D3039/D3039-14
Flexural Strength	25, 19	MD CMD	kpsi	-	IPC-TM-650 2.4.4
Dimensional Stability	-0.48-0.59	MD CMD	mm/m	-	IPC-TM-650 2.4.39a
Coefficient of Thermal Expansion	13	X	ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
	16	Y
	42	Z
Thermal Conductivity	0.64	Z	W/(m.K)	80°C	ASTM D5470
Time to Delamination (T288)	>60	-	minutes	288°C	IPC-TM-650 2.4.24.1
Tg	>280	-	°C TMA	-	IPC-TM-650 2.4.24.3
Td	414	-	°C	-	IPC-TM-650 2.3.40
Moisture Absorption	0.07	-	%	24/23	IPC-TM-650 2.6.2.1
Young’s Modulus	2264 2098	MD CMD	kpsi	-	ASTM D3039/D3039-14
Flex Modulus	2337 2123	MD CMD	kpsi	-	IPC-TM-650 2.4.4
Bow	0.03	-	%	-	IPC-TM-650 2.4.22C
Twist	0.08	-	%	-	IPC-TM-650 2.4.22C
Copper Peel Strength After Thermal Stress	5.8	-	lbs/in	1 oz (35 µm) foil	IPC-TM-650 2.4.8
Flammability	V-0	-	-	-	UL 94
Specific Gravity	1.99	-	g/cm3	-	ASTM D792
Lead-Free Process Compatible	Yes	-	-	-

Our PCB Capability (Kappa 438)

Kappa 438 PCB is available in different layer counts, including double layer, Multi-layer, and Hybrid PCBs.

Customers can choose from copper weights of 1oz (35μm) or 2oz (70μm).

In terms of thickness, it is available in 20mil, 30mil, 40mil, and 60mil variants.

Additionally, the maximum size of the PCB that can be produced with Kappa 438 is 400mm X 500mm, which is suitable for most electronic devices.

Customers have the flexibility to select from a variety of solder mask colors, including Green, Black, Blue, Yellow, Red etc.

Moreover, Various surface finish options are available, including immersion gold, HASL, immersion silver, immersion tin, pure gold, OSP, ENEPIG, bare copper, and several others.

PCB material:	Glass Reinforced Hydrocarbon Ceramic Substrates
Designation:	Kappa 438
Dielectric constant:	4.38
Layer count:	Double layer, Multi-layer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70 µm)
PCB thickness:	20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, Pure gold, OSP, ENEPIG, Bare copper, etc..

A Piece of Kappa 438 PCB

Now displayed on the screen is a 60mil Kappa 438 high frequency PCB with immersion gold for carrier grade WiFi.

Kappa 438 PCB is a versatile option that can be used in a range of applications. It is particularly well-suited for Licensed Assisted Access (LAA), ideal for Small Cell and Distributed Antenna Systems (DAS), high-performance and reliable connectivity for Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) communications

Additionally, for Internet of Things (IoT) applications, it is ideal for use in Smart Home and Wireless Meters, providing efficient and secure wireless communication.

Conclusion

With Kappa 438 laminates, wireless circuit designers can achieve a true breakthrough due to their exceptional performance that surpasses the limitations of FR-4 materials.

These laminates offer an ideal balance of price, performance, and reliability and can be fabricated using standard epoxy/glass (FR-4) processes.

They are also compatible with conventional bondplies and lead-free solder processes.

OK. That concludes today’s episode. Thanks for reading. See you next time.