The secret behind the superiority of IsoClad 933 lies in its unique composition. These laminates utilize a higher non-woven fiberglass/PTFE ratio, creating a highly reinforced combination that surpasses traditional materials.

The non-woven fiberglass/PTFE composite allows IsoClad 933 laminates to be used in applications where conformability is crucial. This means that final circuits can benefit from the flexibility and adaptability of these laminates.

Now, let's take a closer look at the exceptional features and benefits that set IsoClad 933 laminates apart.

Data Sheet
Starting with the electrical properties, IsoClad 933 boasts an impressive dielectric constant (Dk) of 2.33 at 10 GHz, as measured by IPC TM-650 2.5.5.5 under C23/50 conditions. This low Dk ensures efficient signal transmission and optimal performance in high-frequency applications.

The dissipation factor, a critical factor in signal loss, is exceptionally low at 0.0016 at 10 GHz under the same IPC test conditions. This minimal dissipation factor contributes to the overall efficiency and reliability of IsoClad 933.

Moving on to thermal characteristics, the thermal coefficient of Er for IsoClad 933 is -132 ppm/°C, as determined by the adapted IPC TM-650 2.5.5.5 test conducted over a temperature range of -10°C to +140°C. This coefficient indicates the material's stability and reliable performance across varying thermal conditions.

Peel strength, a measure of the material's bond strength, is recorded at 10 lbs. per inch after thermal testing, following IPC TM-650 2.4.8 standards. This high peel strength ensures secure and durable adhesion in PCB applications.

IsoClad 933 exhibits excellent electrical properties, as demonstrated by its volume resistivity of 3.5 x 10^8 MΩ-cm and surface resistivity of 1.0 x 10^8 MΩ, determined by IPC TM-650 2.5.17.1 using C96/35/90 test conditions. These values highlight the material's ability to maintain electrical integrity and resist leakage currents.

With an arc resistance exceeding 180 seconds, as per ASTM D-495 under D48/50 conditions, IsoClad 933 demonstrates remarkable resistance to electrical arcing, ensuring safe and reliable operation even in demanding environments.

Now, let's explore the mechanical properties of IsoClad 933. The material exhibits a tensile modulus of 173 and 147 kpsi, a tensile strength of 6.8 and 5.3 kpsi, a compressive modulus of 197 kpsi, and a flexural modulus of 239 kpsi. These values, determined by ASTM D-638, ASTM D-882, and ASTM D-695, showcase the material's strength, rigidity, and resistance to deformation.

IsoClad 933 also boasts a dielectric breakdown voltage exceeding 45 kV, as measured by ASTM D-149 under D48/50 conditions. This high breakdown voltage ensures reliable insulation and protection against electrical breakdown.

With a density of 2.27 g/cm^3, determined by ASTM D-792 Method A at 23°C, IsoClad 933 strikes an optimal balance between strength and weight, offering lightweight solutions without compromising performance.

In terms of water absorption, IsoClad 933 exhibits a minimal water absorption rate of 0.05% under MIL-S-13949H 3.7.7 and IPC TM-650 2.6.2.2 test conditions (E1/105 + D24/23). This low absorption rate ensures the material's stability and reliability, even in humid environments.

The coefficient of thermal expansion (CTE) for IsoClad 933 is determined through IPC TM-650 2.4.24 using a Mettler 3000 Thermomechanical Analyzer over a temperature range of 0°C to 100°C. The CTE values for the X, Y, and Z axes are 31, 35, and 203 ppm/°C, respectively. These values demonstrate the material's ability to withstand thermal stress and maintain dimensional stability over a wide temperature range.

IsoClad 933 exhibits a thermal conductivity of 0.263 W/mK at 100°C, as measured by ASTM E-1225.

In terms of outgassing properties, the data highlights a minimal total mass loss of 0.03%, absence of collected volatile condensable material, a low water vapor regain of 0.02%, and no visible condensate formation, indicating that IsoClad 933 demonstrates favorable outgassing characteristics.

IsoClad 933 meets the stringent requirements of UL94-V0 as determined by UL 94 Vertical Burn and IPC TM-650 2.3.10 tests under C48/23/50 and E24/125 conditions. This flammability rating ensures the material's compliance with safety standards and enhances its suitability for a variety of applications.

PCB Capability (IsoClad933)
For IsoClad 933 PCBs, we offer a wide range of capabilities. The PCBs can be customized to meet your specific needs, including double-sided PCBs, multilayer PCBs, and hybrid types, allowing for flexible design options.

It comes with different copper weight options, including 1oz (35µm) and 2oz (70µm), providing flexibility in terms of conductivity and power requirements.

Dielectric thickness options are available to suit different design considerations, including 15 mils (0.381mm), 31 mils (0.787mm) and 62 mils (1.575mm). This allows for precise control over the electrical properties and overall thickness of the board.

In terms of size, our PCBs can accommodate dimensions up to 400mm X 500mm, providing ample space for your circuitry and components.

For solder mask options, we offer a variety of colors, including green, black, blue, yellow, and red, among others. This allows for visual customization and differentiation of your PCBs.

Our PCBs can be finished with various surface finishes, including immersion gold, HASL (Hot Air Solder Leveling), immersion silver, immersion tin, OSP (Organic Solderability Preservative), bare copper, pure gold, ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold), and more. These surface finishes provide protection, solderability, and compatibility with different assembly processes.

IsoClad 933 PCB and Typical Applications
Now shown on the screen is a type of double sided IsoClad 933 PCB built on 31mil substrate with blue solder mask and immersion gold for stripline and microstrip circuits.

IsoClad 933 PCBs are also commonly utilized in a variety of applications such as conformal antennas, guidance systems, radar systems, electronic systems, and more.

Final
IsoClad 933 materials are compatible with traditional electroless copper and direct deposit metallization processes. Prior to metal deposition, the cores should be baked for a duration of 30-90 minutes at temperatures ranging from 110°C to 125°C.

Standard equipment and chemical processes are utilized to apply plating, imaging, and etching techniques for creating circuit patterns on IsoClad 933 substrates. It is important to handle the post-etch laminate surface with care to maintain its integrity.

OK. This concludes today’s episode. Thank you for reading. See you next time.