Hybrid PCB 0.305mm RO4003C+High Tg FR4 6-Layer

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Hybrid PCB Built on 0.305mm RO4003C and High Tg FR4 6-Layer Configuration

Shipped: 4th-Dec-2023

1.1. RO4003C Profile: - Rogers RO4003C Hydrocarbon Ceramic woven glass - Dielectric Constant of DK 3.38 at 10 GHz - Dissipation Factor of 0.0027 at 10GHz - Tg >280 °C, Td> 425°C

1.2 FR-4 (IT-180A) Profile - ITEQ's High Tg (175℃ by DSC), Low CTE Epoxy Glass with high thermal reliability - Dielectric Constant of DK 4.4 at 1 GHz - Dissipation Factor of 0.015 at 1 GHz - Tg >175 °C, - T260> 60 minutes, T288 >20 minutes

2. Features and Attentions Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles with all configurations meeting the same laminate electrical performance specification. RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. RO4003C materials are non-brominated and are not UL 94 V-0 rated.

While IT-180A features Excellent CAF resistance, lead-free compatibility, High heat resistance and through-hole reliability, as well as exceptional mechanical processability.

3. Stackup: 6-layer rigid PCB Copper_layer_1 - 35 μm (1oz) Rogers 4003C Core - 12mil (0.305mm) Copper_layer_2 - 35 μm (1oz) Prepreg - 0.1mm Copper_layer_3 - 35μm (1oz) Core IT-180A FR-4 Copper_layer_4 - 35μm (1oz) Prepreg -0.1mm Copper_layer_5 - 35 μm (1oz) Rogers 4003C Core - 12mil (0.305mm) Copper_layer_6 - 35 μm (1oz)

4. Construction details: - Board dimensions: 57mm x 57 mm=1PCS, +/- 0.15mm - Minimum Trace/Space: 4/5 mils - Minimum Hole Size: 0.3mm, via filled and capped. - No Blind vias. - Finished board thickness: 1.1mm - Finished Cu weight: 1oz (1.4 mils) each layer - Via plating thickness: 25 μm - Surface finish: Immersion Gold (ENIG) - Top Silkscreen: White - Bottom Silkscreen: White - Top Solder Mask: Matt Blue - Bottom Solder Mask: Matt Blue - Top 7 mil trace with 90 ohm single-end impdeance controlled. - 100% Electrical test used prior to shipment

5. PCB Statistics: Components: 28 Total Pads: 68 Thru Hole Pads: 32 Top SMT Pads: 21 Bottom SMT Pads: 15 Vias: 73 Nets: 6

6. Type of artwork supplied: Gerber RS-274-X

7. Quality standard: IPC-Class-2

8. Availability: worldwide

9. Some Typical Applications: - Cellular Base Station Antennas and Power Amplifiers - RF Identifi cation Tags - Automotive Radar and Sensors - LNB’s for Direct Broadcast Satellites

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