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Introduction |
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This series laminates are made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. The series is based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics. |
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F4BTM and F4BTME share the same dielectric layer but use different copper foils: F4BTM is paired with ED copper foil, suitable for applications without PIM requirements, while F4BTME is paired with reverse-treated (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss. |
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Features & Benefits |
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- DK range from 2.98 to 3.5 is available - Addition of ceramics enhances the performance. - F4BTME exhibits excellent PIM performance, - Comes in various thicknesses and sizes, offers cost savings - Commercialization, large-scale production, and high cost-effectiveness. - Radiation-resistant and low out-gassing properties |
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Models & Data Sheet |
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Here's a detailed narration of the technical parameters mentioned in the data sheet for F4BTM: |
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Dielectric Constant (Typical): Test Conditions: Measured at 10GHz Unit: Dimensionless F4BTM298: 2.98 F4BTM300: 3.0 F4BTM320: 3.2 F4BTM350: 3.5 The dielectric constant represents the material's ability to store electrical energy when subjected to an electric field. |
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Dielectric Constant Tolerance: F4BTM298: ±0.06 F4BTM300: ±0.06 F4BTM320: ±0.06 F4BTM350: ±0.07 This parameter indicates the acceptable range of variation in the dielectric constant for the specified models. |
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Loss Tangent (Typical): Test Conditions: Measured at 10GHz and 20GHz F4BTM298: 0.0018 F4BTM300: 0.0018 F4BTM320: 0.0020 F4BTM350: 0.0025 The loss tangent refers to the amount of energy dissipated as heat when an electrical signal passes through the material. |
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Dielectric Constant Temperature Coefficient: Test Conditions: Temperature range of -55 oC to 150oC Unit: Parts per million per degree Celsius (PPM/℃) F4BTM298: -78 F4BTM300: -75 F4BTM320: -75 F4BTM350: -60 This parameter indicates the change in dielectric constant with respect to temperature. |
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Peel Strength: Test Conditions: Measured with 1 oz F4BTM and 1 oz F4BTME Unit: Newtons per millimeter (N/mm) F4BTM298: >1.6 F4BTM300: >1.6 F4BTM320: >1.6 F4BTM350: >1.6 Peel strength measures the bonding strength between layers of the material. |
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Volume Resistivity: Test Conditions: Standard conditions Unit: Megaohm centimeters (MΩ.cm) F4BTM298: ≥1×10^7 F4BTM300: ≥1×10^7 F4BTM320: ≥1×10^7 F4BTM350: ≥1×10^7 Volume resistivity indicates the material's resistance to the flow of electrical current through its volume. |
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Surface Resistivity: Test Conditions: Standard conditions Unit: Megaohms (MΩ) F4BTM298: ≥1×10^6 F4BTM300: ≥1×10^6 F4BTM320: ≥1×10^6 F4BTM350: ≥1×10^6 Surface resistivity represents the material's resistance to the flow of electrical current across its surface. |
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Electrical Strength (Z direction): Test Conditions: 5KW, 500V/s Unit: Kilovolts per millimeter (KV/mm) F4BTM298: >26 F4BTM300: >30 F4BTM320: >32 F4BTM350: >32 Electrical strength measures the ability of the material to withstand high voltage without electrical breakdown. |
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Breakdown Voltage (XY direction): Test Conditions: 5KW, 500V/s Unit: Kilovolts (KV) F4BTM298: >34 F4BTM300: >35 F4BTM320: >40 F4BTM350: >40 Breakdown voltage represents the voltage at which the material experiences electrical breakdown in the XY direction. |
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Coefficient of Thermal Expansion: Test Conditions: Temperature range of -55 oC to 288oC Unit: Parts per million per degree Celsius (ppm/oC) XY direction: F4BTM298: 15,16 F4BTM300: 15,16 F4BTM320: 13,15 F4BTM350: 10,12 Z direction: F4BTM298: 78 F4BTM300: 72 F4BTM320: 58 F4BTM350: 51 The coefficient of thermal expansion indicates the material's dimensional change with respect to temperature. |
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Thermal Stress: Test Conditions: 260℃, 10s, 3 times Result: No delamination This parameter assesses the material's ability to withstand thermal stress without experiencing delamination or separation. |
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Water Absorption: Test Conditions: 20±2℃, 24 hours Unit: Percentage (%) F4BTM298: ≤0.05 F4BTM300: ≤0.05 F4BTM320: ≤0.05 F4BTM350: ≤0.05 Water absorption represents the amount of water the material can absorb under specified conditions. |
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Density: Test Conditions: Room temperature Unit: Grams per cubic centimeter (g/cm3) F4BTM298: 2.25 F4BTM300: 2.25 F4BTM320: 2.20 F4BTM350: 2.20 Density indicates the mass of the material per unit volume. |
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Long-Term Operating Temperature: Test Conditions: High-Low Temperature Chamber Unit: Celsius (℃) Temperature Range: -55 to +260 This parameter specifies the temperature range within which the material can operate over an extended period of time. |
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Thermal Conductivity (Z direction): Test Conditions: Measured in watts per meter-kelvin (W/(M.K)) F4BTM298: 0.42 F4BTM300: 0.42 F4BTM320: 0.50 F4BTM350: 0.54 Thermal conductivity measures the material's ability to conduct heat in the Z direction. |
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PIM (Only applicable to F4BTME): Unit: Decibels relative to carrier (dBc) F4BTME: ≤-160 PIM, or Passive Intermodulation, refers to the generation of unwanted signals caused by nonlinearities in the material when exposed to high-frequency signals. |
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Flammability: Unit: UL-94 rating F4BTM298: V-0 F4BTM300: V-0 F4BTM320: V-0 F4BTM350: V-0 Flammability rating indicates the material's resistance to ignition and flame spread according to the UL-94 standard. |
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Material Composition: This section provides information about the components used in the F4BTM material, including PTFE (Polytetrafluoroethylene), Fiberglass Cloth, nano-ceramics, and the specific pairing of F4BTM with either ED copper foil or reverse-treated (RTF) copper foil for F4BTME. |
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Product Technical Parameters |
Product Models & Data Sheet |
Product Features |
Test Conditions |
Unit |
F4BTM298 |
F4BTM300 |
F4BTM320 |
F4BTM350 |
Dielectric Constant (Typical) |
10GHz |
/ |
2.98 |
3.0 |
3.2 |
3.5 |
Dielectric Constant Tolerance |
/ |
/ |
±0.06 |
±0.06 |
±0.06 |
±0.07 |
Loss Tangent (Typical) |
10GHz |
/ |
0.0018 |
0.0018 |
0.0020 |
0.0025 |
20GHz |
/ |
0.0023 |
0.0023 |
0.0026 |
0.0035 |
Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-78 |
-75 |
-75 |
-60 |
Peel Strength |
1 OZ F4BTM |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
1 OZ F4BTME |
N/mm |
>1.4 |
>1.4 |
>1.4 |
>1.4 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>32 |
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>34 |
>35 |
>40 |
>40 |
Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
15，16 |
15，16 |
13，15 |
10，12 |
Z direction |
-55 º~288ºC |
ppm/ºC |
78 |
72 |
58 |
51 |
Thermal Stress |
260℃, 10s，3 times |
No delamination |
No delamination |
No delamination |
No delamination |
Water Absorption |
20±2℃, 24 hours |
% |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
Density |
Room Temperature |
g/cm3 |
2.25 |
2.25 |
2.20 |
2.20 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.42 |
0.42 |
0.50 |
0.54 |
PIM |
Only applicable to F4BTME |
dBc |
≤-160 |
≤-160 |
≤-160 |
≤-160 |
Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
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PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. |
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Our PCB Capability (F4BTM) |
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Here are the capabilities of the F4BTM material: |
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Layer Count: F4BTM supports Single Sided, Double Sided PCB, Multilayer PCB, and Hybrid PCB configurations. |
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Copper Weight: F4BTM can accommodate copper weights of 0.5oz (17 μm), 1oz (35μm), and 2oz (70μm). |
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Dielectric Thickness (or Overall Thickness): F4BTM offers a range of dielectric thickness options, including 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, and 12.0mm. |
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PCB Size: The maximum size for F4BTM PCBs is 400mm X 500mm. |
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Solder Mask: F4BTM supports various solder mask colors, including Green, Black, Blue, Yellow, Red, and more. |
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Surface Finish: F4BTM can be used with different surface finishes, such as Bare copper, HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), Immersion silver, Immersion tin, OSP (Organic Solderability Preservative), Pure gold, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), and more. |
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PCB Capability (F4BTM) |
PCB Material: |
PTFE / glass fiber cloth / Nano-ceramic filler |
Designation (F4BTM ) |
F4BTM |
DK (10GHz) |
DF (10 GHz) |
F4BTM298 |
2.98±0.06 |
0.0018 |
F4BTM300 |
3.0±0.06 |
0.0018 |
F4BTM320 |
3.2±0.06 |
0.0020 |
F4BTM350 |
3.5±0.07 |
0.0025 |
Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness (or overall thickness) |
0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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F4BTM PCB and Applications |
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The screen displays a DK 3.0 F4BTM PCB, constructed on a 1.524mm substrate and featuring HASL surface finishes. |
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This type of PCB is utilized in various applications, including Antenna, Mobile Internet, Sensor Network, Radar, Millimeter Wave Radar, Aerospace, Satellite Navigation, Beidou, Missile-borne, Power Amplifier, and Radio Frequency. |
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Final （F4BTM series aluminum-based/copper-based substrates） F4BTM series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side of the dielectric layer is covered with either aluminum-based or copper-based material. This arrangement serves the purpose of shielding or heat dissipation. |
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For examples, F4BTM300-AL represents F4BTM300 with aluminum-based substrate. |
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