F4BM220 PCB 60MIL | Bicheng PCB

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F4BM220 High Frequency PCB Double Sided Board 60mil 1.524mm Thickness

Shipped: 16th-Nov-2023

Let's introduce a type of our latest shipment of F4BM printed circuit boards, a remarkable line of PCBs manufactured with meticulous preparation and strict processes.

F4BM220 Introduction: F4BM laminates combine glass fiber cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film to achieve exceptional electrical performance. Compared to the F4B series, the F4BM laminates demonstrate significant improvements, including a wider range of dielectric constants, low dielectric loss, increased insulation resistance, and enhanced stability. As a result, the F4BM laminates are an excellent substitute for similar foreign products.

F4BM employs forward rotating ED copper foil for cladding, making it ideal for applications that do not require PIM indicators. With precise adjustments to the ratio between polytetrafluoroethylene and glass fiber cloth, the F4BM series achieves a low loss and enhances dimensional stability. As the dielectric constant increases, the proportion of glass fiber also increases, resulting in improved dimensional stability, reduced coefficient of thermal expansion, enhanced temperature fluctuation performance, and decreased dielectric loss.

F4BM220, one of the products in the F4BM series, boasts a dielectric constant of 2.2 and a dissipation factor of 0.001 at 10GHz.

Key Features: Dielectric constant of 2.2 with a tight tolerance of 0.04 at 10 GHz and 23°C, ensuring precise performance. Loss tangent of 0.001 at 10GHz, minimizing signal loss. Temperature coefficient of dielectric constant (TCDk) of -142 ppm/°C, maintaining stability across temperature variations. Moisture absorption of 0.08%, providing protection against moisture-related issues. Coefficient of Thermal Expansion (CTE): X-axis CTE of 25 ppm/°C, Y-axis CTE of 34 ppm/°C, and Z-axis CTE of 240 ppm/°C, ensuring dimensional stability.

Benefits: Low loss tangent, minimizing signal loss and maximizing performance. Diversified size options and cost-saving benefits. Resistance to irradiation and low exhaust. Commercialization, mass production, and high cost performance.

PCB Stackup: 2-layer rigid PCB Copper_layer_1: 35 μm F4BM220: 1.524 mm (60 mil) Copper_layer_2: 35 μm

PCB Construction Details: Board dimensions: 392 mm x 256 mm (1 PCS), with a tolerance of +/- 0.15 mm. Minimum Trace/Space: 7/6 mils Minimum Hole Size: 0.3 mm No blind vias. Finished board thickness: 1.6 mm Finished copper weight: 2 oz (2.8 mils) for outer layers Via plating thickness: 20 μm Surface finish: Immersion gold Top Silkscreen: No Bottom Silkscreen: No Top Solder Mask: No Bottom Solder Mask: No 100% Electrical test conducted before shipment

PCB Statistics: Components: 129 Total Pads: 260 Thru-Hole Pads: 107 Top SMT Pads: 153 Bottom SMT Pads: 0 Vias: 172 Nets: 4

Artwork Type: Gerber RS-274-X Accepted Standard: IPC-Class-2 Availability: Worldwide

Typical Applications: Microwave, RF, and radar systems Phase shifters andpassive components Power dividers, couplers, and combiners Feed networks and phased array antennas Satellite communication and base station antennas

Appendix: F4BM220 Data sheet

Parameter	Value
Product Model	F4BM220
Dk(εr) @10G	2.20±0.04
Df(tgδ) @10G	0.001
TcDk ppm/ºC	-142
Density (g/cm3)	2.18
Peel Strength (1OZ) N/mm	>1.8
Coefficient of Thermal Expansion ppm/ºC (X)	25
Coefficient of Thermal Expansion ppm/ºC (Y)	34
Coefficient of Thermal Expansion ppm/ºC (Z)	240
Volume Resistivity Mohm.cm	>6×10^6
Surface Resistivity Mohm	>1×10^6
Moisture Absorption (%)	≤0.08
Thermal Conductivity W/m/°k	0.24
PIM (dBc)	/
Long-Term Operating Temperature (ºC)	-55～260
Flame Retardant Grade UL 94	V-0

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