Diclad 870 PCB 31mil | Bicheng PCB

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Rogers DiClad 870 High Frequency PCB Double Layer 31mil 0.787mm Thickness

Shipped: 23rd-Nov-2023

Let's introduce a type of our latest delivery of DiClad 870 PCBs, an exceptional line of PTFE-based composites from us.

DiClad 870 Introduction: These laminates feature woven fiberglass reinforcement and offer a reduced dielectric constant, making them ideal for printed circuit board substrates. By utilizing fewer fiberglass plies and a higher ratio of PTFE content, the DiClad 870 laminates provide lower dielectric constants (Dk) and dissipation factors, all while maintaining a comparable thickness to other laminates in the DiClad series.

Key Features: DK of 2.33 at 10 GHz and 1 MHz, 50% RH, enabling reliable signal transmission. Dissipation factor of 0.0013 at 10 GHz, 0.0009 at 1 MHz, 50% RH, ensuring efficient and high-performance circuitry. TcDK (Temperature Coefficient of Dk) of -161 ppm/°C ranging from -10°C to 140°C at 10 GHz, maintaining stability across temperature variations. Moisture absorption of 0.02%, offering superior protection against moisture-related issues. Coefficient of Thermal Expansion (CTE): X-axis CTE of 17 ppm/°C, Y-axis CTE of 29 ppm/°C, and Z-axis CTE of 217 ppm/°C, providing excellent dimensional stability.

Benefits: Extremely low loss tangent, minimizing signal loss. Excellent dimensional stability, ensuring precise registration and alignment. Consistent product performance, guaranteeing uniformity across various applications. Highly uniform electrical properties across a wide frequency range. Reliable mechanical performance, delivering consistent and reliable results. Excellent chemical resistance, safeguarding against corrosive elements. Lowest moisture absorption among PTFE-based composites, enhancing overall reliability. Stable Dk over a wide frequency range, enabling consistent signal transmission. Low Dk supports wider line widths, resulting in lower insertion loss.

PCB Stackup: 2-layer rigid PCB Copper_layer_1: 35 μm DiClad 870: 0.787 mm (31 mil) Copper_layer_2: 35 μm

PCB Construction Details: Board dimensions: 174 mm x 44.5 mm (1 PCS), with a tolerance of +/- 0.15 mm. Minimum Trace/Space: 4/4 mils Minimum Hole Size: 0.25 mm No blind vias Finished board thickness: 0.8 mm Finished copper weight: 1 oz (1.4 mils) for outer layers Via plating thickness: 20 μm Surface finish: ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) Top Silkscreen: White Bottom Silkscreen: White Top Solder Mask: Green Bottom Solder Mask: Green 100% Electrical test conducted before shipment

PCB Statistics: Components: 42 Total Pads: 103 Thru-Hole Pads: 68 Top SMT Pads: 35 Bottom SMT Pads: 0 Vias: 73 Nets: 3

Artwork Type: Gerber RS-274-X Accepted Standard: IPC-Class-2 Availability: Worldwide

Typical Applications: Radar Feed Networks Commercial Phased Array Networks Low Loss Base Station Antennas Guidance Systems Digital Radio Antennas Filters, Couplers, LNAs

Appendix: DiClad 870 Data sheet

Property	DiClad 870	Condition	Test Method
Electrical Properties
Dielectric Constant ?@ 10 GHz	2.33	C23/50	IPC TM-650 2.5.5.5
Dielectric Constant ?@ 1 MHz	2.33	C23/50	IPC TM-650 2.5.5.3
Dissipation Factor @ 10 GHz	0.0013	C23/50	IPC TM-650 2.5.5.5
Dissipation Factor @ 1 MHz	0.0009	C23/50	IPC TM-650 2.5.5.3
Thermal Coefficient of Er (ppm/°C)	-161	-10°C to +140°C	IPC TM-650 2.5.5.5 Adapted
Volume Resistivity (MΩ-cm)	1.5 x 10 9	C96/35/90	IPC TM-650 2.5.17.1
Surface Resistivity (MΩ)	3.4 x 10 7	C96/35/90	IPC TM-650 2.5.17.1
Arc Resistance	>180	D48/50	ASTM D-495
Dielectric Breakdown (kV)	>45	D48/50	ASTM D-149
Mechanical Properties
Peel Strength ?(lbs.per inch)	14	After Thermal Stress	IPC TM-650 2.4.8
Tensile Modulus (kpsi)	485(MD), 346(CD)	A, 23°C	ASTM D-638
Tensile Strength (kpsi)	14.9(MD), 11.2 (CD)	A, 23°C	ASTM D-882
Compressive Modulus (kpsi)	327	A, 23°C	ASTM D-695
Flexural Modulus (kpsi)	437	A, 23°C	ASTM D-790
Thermal Properties
Coefficient of Thermal Expansion (ppm/°C) X Axis Y Axis Z Axis	17 29 217	0°C to 100°C	IPC TM-650 2.4.24 Mettler3000 Thermomechanical Analyzer
Thermal Conductivity (W/mK)	0.257	100°C	ASTM E-1225
Flammability UL	Meets requirements of UL94-V0	C48/23/50, E24/125	UL 94 Vertical Burn IPC TM-650 2.3.10
Physical Properties
Density (g/cm3)	2.26	A, 23°C	ASTM D-792 Method A
Water Absorption (%)	0.02	E1/105 + D24/23	MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2
Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) ? Visible Condensate (±)	0.02 0.00 0.01 NO	125°C, ≤ 10-6 torr	NASA SP-R-0022A Maximum 1.00% Maximum 0.10%

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