Diclad 527 20mil PCB| Bicheng PCB

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Rogers DiClad 527 High Frequency PCB Double Sided Board 20mil 0.508mm Thickness

Shipped: 17th-Nov-2023

Let us introduce a type of our latest shipment of DiClad 527 high frequency PCBs, a remarkable line of composite materials from us.

DiClad 527 Introduction: Rogers presents DiClad 527 laminates, specially engineered with woven fiberglass reinforcement and a PTFE-based composite to serve as exceptional printed circuit board substrates. These laminates boast a higher ratio of fiberglass reinforcement to PTFE content, delivering an extended dielectric constant (Dk) range, enhanced dimensional stability, and improved registration accuracy.

Key Features: DK range of 2.4 to 2.6 at 10 GHz and 1 MHz, 50% RH, ensuring reliable signal transmission. Dissipation factor of 0.0017 at 10 GHz, 0.0010 at 1 MHz, 50% RH, for efficient and high-performance circuitry. TcDK (Temperature Coefficient of Dk) of -153 ppm/°C ranging from -10°C to 140°C at 10 GHz, maintaining stable performance across temperature variations. Low moisture absorption of 0.03%, safeguarding against moisture-related issues. Coefficient of Thermal Expansion (CTE): X-axis CTE of 14 ppm/°C, Y-axis CTE of 21 ppm/°C, and Z-axis CTE of 173 ppm/°C, providing excellent dimensional stability.

Benefits: Extremely low loss tangent, ensuring minimal signal loss. Excellent dimensional stability, maintaining precise registration and alignment. Consistent product performance, ensuring uniformity across different applications. Highly uniform electrical properties across a wide frequency range. Reliable mechanical performance, delivering consistent results. Excellent chemical resistance, protecting against corrosive elements. Stable Dk over a wide frequency range, enabling consistent signal transmission. Low circuit losses at high frequencies, facilitating efficient signal processing. Negligible performance drift caused by high humidity environments, ensuring reliable operation.

PCB Stackup: 2-layer rigid PCB Copper_layer_1: 35 μm DiClad 527: 0.508 mm (20 mil) Copper_layer_2: 35 μm

PCB Construction Details: Board dimensions: 173.78 mm x 121.28 mm (1 PCS), with a tolerance of +/- 0.15 mm. Minimum Trace/Space: 5/4 mils Minimum Hole Size: 0.3 mm No blind vias Finished board thickness: 0.6 mm Finished copper weight: 1 oz (1.4 mils) for outer layers Via plating thickness: 20 μm Surface finish: ENIG (Electroless Nickel Immersion Gold) Top Silkscreen: White No bottom silkscreen Top Solder Mask: Green No bottom solder mask 100% Electrical test conducted before shipment

PCB Statistics: Components: 53 Total Pads: 125 Thru-Hole Pads: 79 Top SMT Pads: 46 Bottom SMT Pads: 0 Vias: 84 Nets: 4

Artwork Type: Gerber RS-274-X Accepted Standard: IPC-Class-2 Availability: Worldwide

Typical Applications: Radar Feed Networks Commercial Phased Array Networks Low Loss Base Station Antennas Guidance Systems Digital Radio Antennas Filters, Couplers, LNAs

Appendix: DiClad 527 Data sheet

Properties		DiClad 527	Units	Test Conditions		Test Method
Electrical Properties
Dielectric Constant		2.40-2.60	-	23˚C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant		2.40-2.60	-	23˚C @ 50% RH	1 MHz	IPC TM-650 2.5.5.3
Dissapation Factor		0.0017	?	23˚C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5
Dissapation Factor		0.0010	?	23˚C @ 50% RH	1 MHz	IPC TM-650 2.5.5.3
Thermal Coefficient of Dielectric Constant		-153	ppm/˚C	-10 to 140˚C	10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity		1.2 x 109	MΩ-cm	C96/35/90	-	IPC TM-650 2.5.17.1
Surface Resistivity		4.5 x 107	MΩ	C96/35/90	-	IPC TM-650 2.5.17.1
Dielectric Breakdown		>45	kV	D48/50	-	ASTM D-149
Arc Resistance		>180		-	-	ASTM D-495
Thermal Properties
Coefficient of Thermal Expansion - x		14	ppm/˚C	-	50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y		21	ppm/˚C	-	50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z		173	ppm/˚C	-	50˚C to 150˚C	IPC TM-650 2.4.24
Thermal Conductivity		0.26	W/(m.K)	?	?	ASTM E1461
Mechanical Properties
Copper Peel Strength		14	Lbs/in	10s @288˚C	35 μm foil	IPC TM-650 2.4.8
Young’s Modulus		517, 706	kpsi	23˚C @ 50% RH	-	ASTM D-638
Tensile Strength (MD, CMD)		19.0, 15.0	kpsi	23˚C @ 50% RH	-	ASTM D-882
Compressive Modulus		359	kpsi	23˚C @ 50% RH	-	ASTM D-695
Flex Modulus		537	kpsi	23˚C @ 50% RH	?	ASTM D-3039
Physical Properties
Flammability		V-0	?	?	C48/23/50 & C168/70	UL 94
Moisture Absorption		0.03	%	E1/105+D24/23		IPC TM-650 2.6.2.2
Density		231	g/cm³	C24/23/50	Method A	ASTM D792
NASA Outgassing	????Total Mass Lost	0.02	%	125°C, ≤ 10-6 torr		NASA SP-R-0022A
	????Collected Volatiles	0.00	%
	????Water Vapor Recovered	0.01	%

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