Rogers DiClad 527 laminates are composite materials based on woven fiberglass reinforcement and PTFE. They are specifically designed for use as substrates in printed circuit boards.

DiClad 527 laminates offer a greater proportion of fiberglass reinforcement compared to PTFE content. This precise controlled ratio results in an expanded range of dielectric constants (Dk) and enhanced dimensional stability and registration.

Next, let's take a look at the table of data sheet to understand the specific performance characteristics of the material.

Data Sheet
DiClad 527 boasts a same dielectric constant range from 2.40 to 2.60 at 23˚C and 50% relative humidity, tested at 10GHz and 1MHz. This characteristic ensures efficient signal propagation.

The dissipation factor, a measure of energy loss, is exceptionally low at 0.0017 at a frequency of 10 GHz and 0.0010 at a frequency of 1 MHz, guaranteeing minimal signal distortion.

Furthermore, the thermal coefficient of dielectric constant is -153 ppm/˚C in the temperature range of -10 to 140˚C at 10 GHz, following IPC TM-650 2.5.5.5 test method.

The volume resistivity is 1.2 x 10^9 MΩ-cm, measured using C96/35/90 test method; and the surface resistivity is 4.5 x 10^7 MΩ, determined with C96/35/90 test method, exhibiting excellent electrical insulation properties.

The arc resistance value of over 180 further enhances its robustness.

DiClad 527 demonstrates remarkable thermal performance. The coefficient of thermal expansion is 14 ppm/˚C (x), 21 ppm/˚C (y), and 173 ppm/˚C (z) in the temperature range of 50˚C to 150˚C, as per IPC TM-650 2.4.41 and IPC TM-650 2.4.24 test methods, respectively.

The material exhibits a thermal conductivity of 0.26 W/(m.K), following ASTM E1461 test method.

When it comes to mechanical strength, DiClad 527 excels. With a copper peel strength of 14 Lbs/in, it provides a strong bond even at high temperatures (tested at 288˚C for 10 seconds using 35 μm foil).

Its Young's modulus, a measure of stiffness, ranges from 517 to 706 kpsi, ensuring structural integrity.

Tensile strength values of 19.0 kpsi (MD) and 15.0 kpsi (CMD) highlight its resistance to deformation under tension.

Additionally, the compressive modulus of 359 kpsi and flex modulus of 537 kpsi attest to its ability to withstand compressive and flexural loads, respectively.

In terms of safety and reliability, DiClad 527 meets rigorous standards. It achieves a flammability rating of V-0, indicating excellent flame resistance.

With moisture absorption of just 0.03%, it remains dimensionally stable even in humid environments. The material's density of 231 g/cm³ ensures compact designs without compromising performance.

Notably, DiClad 527 has undergone NASA outgassing testing, a critical consideration for space applications. During this evaluation, the material exhibited a minimal total mass loss of 0.02% at 125°C and ≤ 10^-6 torr vacuum pressure. The collected volatiles were measured at 0%, and water vapor recovery reached an impressive 0.01%.

PCB Capability (DiClad 527)
We support various layer configurations for DiClad 527 PCBs, including single-sided, double-sided, multi-layer PCBs, and hybrid PCBs. This flexibility enables the implementation of complex circuit designs and seamless integration of different components within the PCBs we offer.

We offer the flexibility to choose the copper weight for DiClad 527 PCBs too. You can select from options such as 1oz (35µm) and 2oz (70µm), which cater to specific electrical and thermal requirements.

To meet your design requirements and achieve the desired electrical performance, we manufacture DiClad 527 PCBs with dielectric thicknesses of 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm). This variety in dielectric thickness empowers you to make informed decisions and achieve the desired performance characteristics for your PCBs.

We understand the importance of size considerations in PCB design. Our company accommodates DiClad 527 PCBs with a maximum size of 400mm x 500mm. This size limitation ensures that your PCBs can be effectively utilized for a wide range of applications.

Our selection of solder mask colors includes green, black, blue, yellow, red, and more. You can choose the appropriate solder mask color that suits your aesthetic preferences or specific application requirements.

At our company, we offer a variety of surface finishes for DiClad 527 PCBs, catering to your specific application needs. The available options include immersion gold, HASL (Hot Air Solder Leveling), immersion silver, immersion tin, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), OSP (Organic Solderability Preservative), bare copper and pure gold etc.

DiClad 527 PCB and Typical Applications
Displayed on the screen is a 20mil DiClad 527 PCB coating immersion gold for digital radio antennas.

DiClad 527 PCBs find typical applications in a range of industries and technologies. Some specific applications where they excel include radar feed networks, commercial phased array networks, low loss base station?antennas, guidance systems, filters, couplers and LNAs etc.

Final (metallization)
DiClad 527 materials can be seamlessly integrated into conventional electroless copper and direct deposit metallization processes. Prior to metal deposition, it is advisable to bake the cores for 30-90 minutes at temperatures ranging from 110°C to 125°C (230°F - 260°F), unless the hole walls have been prepared for plating using plasma, which also acts as a vacuum bake.

To enhance the structural integrity of the hole walls during outer-layer processing, it is recommended to apply a flash plate build-up of copper measuring 0.0001" to 0.0003" (2.5µm - 7.6µm).