We are pleased to unveil our latest delivery of the CER-10 PCB, a remarkable solution that brings exceptional performance to your high-power connectivity requirements. With its advanced features and innovative design, the CER-10 PCB sets a new benchmark for reliability and efficiency. Experience the power of CER-10 and revolutionize your connectivity solutions.

Introduction to CER-10:
The CER-10 laminate combines Taconic's expertise in ceramic fill technology and coated PTFE fiberglass, featuring a woven glass reinforcement. With outstanding interlaminar bond strength and solder resistance, CER-10 stands out among its counterparts. Its proprietary composition ensures minimal moisture absorption and consistent electrical properties. The woven glass reinforcement contributes to excellent dimensional stability and enhanced flexural strength. The low Z-axis expansion (CTE 46 ppm/°C) of this DK-10 laminate ensures reliable plated-through-hole performance even in extreme thermal environments.

Key Features:
Precisely controlled dielectric constant of 10 ± 0.05 at 10 GHz/23°C, enabling reliable signal transmission.
Low dissipation factor of 0.0035 at 10 GHz/23°C, ensuring efficient and high-performance circuitry.
Thermal conductivity of 0.63 W/mK, facilitating effective heat dissipation.
Moisture absorption rate of 0.02%, safeguarding against moisture-related issues and maintaining consistent performance.
Coefficient of Thermal Expansion (CTE) ranging from -55 to 288 °C: X-axis 13 ppm/°C, Y-axis 15 ppm/°C, Z-axis 46 ppm/°C, ensuring stability in varying temperature conditions.

Benefits:
Exceptional interlaminar bond strength, ensuring reliable and durable PCB construction.
Low moisture absorption, safeguarding against environmental factors and maintaining consistent electrical properties.
Enhanced dimensional stability, contributing to reliable performance and long-term durability.
Low Z-axis expansion, ensuring reliable plated-through-hole performance even in extreme thermal environments.
Stable dielectric constant over frequency, providing consistent signal transmission and reception.
Enables circuit miniaturization, facilitating compact and space-efficient designs.
Increased flexural strength, enhancing the overall reliability and durability of the PCB.

PCB Stackup: 2-layer rigid PCB
Copper_layer_1: 35 μm
CER-10 Substrate: 25 mil (0.635 mm)
Copper_layer_2: 35 μm

PCB Construction Details:
Board dimensions: 95 mm x 89 mm (1 PCS)
Minimum Trace/Space: 4/6 mils
Minimum Hole Size: 0.3 mm
No blind vias
Finished board thickness: 0.8 mm
Finished copper weight: 1 oz (1.4 mils) for outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Gold
Top Silkscreen: Black
No bottom silkscreen
No top or bottom solder mask
100% Electrical test conducted prior to shipment

PCB Statistics:
Components: 24
Total Pads: 70
Thru-Hole Pads: 42
Top SMT Pads: 28
Bottom SMT Pads: 0
Vias: 47
Nets: 3
Artwork Type: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

Typical Applications:
Power Amplifiers
Filters and Couplers
Passive Components

Appendix: CER-10 Data Sheet